ANKUR UPADHYAY
Gurgaon
Summary
Senior Software Engineer with over 5 years of expertise in Embedded development and kernel-level debugging. Proven track record in enhancing platform performance and system stability, alongside the successful implementation of scalable CI/CD pipelines for Qualcomm SoC platforms. Core competencies include low-level driver enhancements, and a strong focus on optimizing software solutions. Aiming to leverage technical skills to drive innovation in software development.
Overview
5
5
years of professional experience
1
1
Certification
Work History
Senior Software Engineer
Q3 Technologies Pvt. Ltd.
Gurgaon
06.2025 - Current
- Working on SV670Q SCHOK mobile device using Qualcomm KAMORTA / DIVAR chipset, involving customization and integration of OEM Android applications within AOSP and vendor frameworks, and mapping custom apps with preloaded system applications and platform services for device-specific requirements.
- Responsible for modifying Android application and framework layers, ensuring compatibility with HAL, BSP, and vendor images, along with managing system app signing, permissions, and privileged app configurations.
- Performing Android OS compilation and build for mobile devices, handling system, vendor, and boot images, and supporting end-to-end build pipelines using toolchains and BSPs.
Software Engineer 2
Qualcomm India Pvt. Ltd. (payroll at Mirafra Software Technology)
Hyderabad
10.2022 - 06.2025
- Performed platform enablement for new DSP chipsets by extending the existing SDK with hardware-specific features and configurations.
- Worked on embedded software stack adaptation for new targets, including code integration, build process, and system-level validation.
- Managed release branches and coordinated end-to-end SDK release cycles, ensuring timely delivery, aligned with the chipset SDK release schedule.
Project Associate
CDAC
Bangalore
05.2021 - 09.2022
- Developed MAC FSM-based transmission/reception control and a custom MAC/PHY communication stack for embedded systems.
- Designed a scalable packet protocol for sensor data exchange between the device and the server, supporting dynamic payloads and extensibility.
Education
PG-DESD - Embedded
CDAC
Bangalore, India04-2021
B.Tech - Electrical, Electronics And Communications Engineering
BBDNIIT
Lucknow, India06-2018
Skills
- Android AOSP / BSP Development
- Qualcomm SoC Platforms
- Device Drivers (Linux / Embedded)
- HAL & Framework Integration
- Build & Release Engineering (Android / Embedded)
- Bootloader, System & Vendor Images
- Embedded Networking (MAC / PHY Layers)
- Platform Debugging & Bring-Up
- RTOS / Embedded Linux Internals
- Firmware and low-level software development
Certification
- Porting Linux on Swadeshi Processors (VEGA Processor) - NIELIT Calicut & CDAC TVDM
- Embedded Application Development with Swadeshi Processor (SHAKTI RISC V) - IIT Madras & NIELIT Calicut
Timeline
Senior Software Engineer
Q3 Technologies Pvt. Ltd.
06.2025 - Current
Software Engineer 2
Qualcomm India Pvt. Ltd. (payroll at Mirafra Software Technology)
10.2022 - 06.2025
Project Associate
CDAC
05.2021 - 09.2022
PG-DESD - Embedded
CDAC
B.Tech - Electrical, Electronics And Communications Engineering
BBDNIIT