ARUN JYOTHI

Bringing over 8+ years of expertise in high-speed board design, energy sector, secure locking solutions, and analog PCB layouts across medical, aerospace, and industrial domains.

Eager to contribute expertise in a dynamic and challenging environment, leveraging my skills to drive organizational success while fostering continuous professional growth.

• Successfully led and mentored a design team, emphasizing professional growth, collaboration, and process improvements.

• Enhanced business–technology alignment by standardizing workflows, implementing strategic initiatives, and driving continuous improvement.

• Delivered projects with cost-effective and optimized schematics, minimizing rework and ensuring customer satisfaction.

• Prepared risk assessment documentation, proactively identified challenges, and worked with stakeholders to define mitigation strategies.

• Consistently recognized for delivering high-quality, error-free designs within deadlines.

Manager’s Choice Award  – For exceptional commitment and successful delivery of the GPS-eBPL project, overcoming schedule challenges and multiple design iterations. 

• Client & Management Appreciation (Capacitive Touch PCB Project) – Recognized for designing a 6-layer PCB with optimized stack-up, routing, and LED–touch integration, ensuring manufacturability and signal integrity. 

• Leadership Recognition (McKinley Plus VAVE Package) – Appreciated for contributions in BLE chip/antenna optimization, RF approvals, and HFSS simulation support, enabling robust system design and smooth release. 

Spot Awards & Special Recognitions for excellence in: 

• Secure & Embedded Systems – Small Form Factor Lock (SFFL), BROOKS multi-board integration. 

• High-Speed & Mixed-Signal Designs – ESA Rev 3.0 & 4.0, ABL Low Voltage Remote, Spacelabs Medical (16-layer analog/digital with high-speed interfaces), ICELAND DDR4 (8-layer), McKinley BLE & Wi-Fi antenna optimization.

• Process & Tool Migration – Hubbell database conversion (PADS → Altium), iROBOT (Nexus migration, Jira handling, library creation). 

• System-Level Products – Smoke/CO Alarm (AC-powered with battery backup – G1 Smoke-only & G2 Smoke+CO variants). 

• RF Design Excellence – Special recognition for advanced RF board design in the Hubbell Project.

• Interpreted and analyzed customer specifications; engaged in requirement discussions with external clients and internal project managers.

• Conducted requirement gathering and clarification sessions to ensure a clear understanding of customer needs.

• Developed and maintained symbol libraries for schematics and footprint libraries across multiple PCB design tools.

• Executed engineering change activities including PCB layout modifications, schematic updates, and documentation per change-control processes.

• Designed double-sided and multi-layer PCBs using industry-standard methods with strong focus on DFx compliance (Design for Assembly, Test, and Manufacture).

• Applied constraint management techniques and integrated them within CAD tools.

• Estimated design efforts, reviewed task scope, and flagged deviations against planned work.

• Delivered PCB designs on time and within cost-quality-performance requirements.

• Maintained a PCB task register, tracked progress, and updated design status/tickets in real time.

• Collaborated with electronics and RF engineers to create and refine schematics.

• Strong expertise in Cadence Allegro PCB (layout) and Concept HDL/Allegro Design Entry (schematics).

• Implemented best practices in PCB design for manufacturability through DFx reviews.

• Recognized for effective communication, customer engagement, and stakeholder coordination.

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Technologies & Product Domains:

• High-Speed Interfaces: DDR4, SODIMM, HDMI, USB, Ethernet

• Signal Types: Power signals, Analog/Digital converters, Filter sections

• Connectivity: Chip antennas, BLE modules (PG23, BG24, MG24), SPI interfaces

• Board Technologies: Board-edge connectors, RF designs, mixed-signal integration

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Project Portfolio – Allegion:

Interflex

• Designed a 4-layer PCB with MPU BG22 and chip antenna.

• Delivered full cycle from library creation to Gerber release, addressing DFM queries with manufacturers.

CISA

• Developed a 4-layer PCB with chip antenna, MG24, and PG23 modules.

• Completed entire workflow from library development to Gerber release, ensuring manufacturability.

CISA Board Bring-up (Extended Role)

• Took initiative beyond design scope by conducting hardware validation tests:

• Power measurements, BLE performance tests, BLE tuning, NFC range validation.

• Documented and reported findings, showcasing initiative and cross-functional expertise.

GPS-eBPL

• Designed a 4-layer PCB with separated power and main board sections plus chip antenna integration.

• Managed tight schedules and multiple design changes, demonstrating flexibility and commitment.

• Awarded Manager’s Choice Award for exceptional effort and successful delivery.

Capacitive Touch PCB

• Designed a 6-layer PCB with dedicated ground, power, and signal planes.

• Integrated LED indicators with capacitive touch pads for enhanced user interaction.

• Optimized stack-up, routing, and clearances for manufacturability and signal integrity.

McKinley Plus VAVE Package

• Designed a 6-layer PCB with optimized BLE chip and antenna integration.

• Supported HFSS simulations and RF reviews for compliance and performance validation.

• Contributed to system-level architecture decisions, ensuring design robustness and timely release.

Hubbell 

• Designed a 4-layer RF board, managing the entire workflow from library creation to Gerber release.

Small Form Factor Lock (SFFL) 

• Developed a 4-layer PCB for a next-generation lock system tailored for luxury hotels and high-end customers. 

• Delivered complete design from library creation to Gerber release.

ESA Rev 3.0 & 4.0

• Designed a 6-layer mixed-signal PCB integrating analog and digital components. 

• Managed library creation, constraint setup, and Gerber release.

ABL (Low Voltage Remote 1.0 & 2.0) 

• Designed a 10-layer RF and power PCB with blind/buried vias and high-density routing. 

• Handled library development and Gerber release, ensuring manufacturability.

Spacelabs (Medical Project)

• Designed a 16-layer impedance-controlled PCB featuring

• Ethernet, USB, and board-edge connectors 

• DDR4, SODIMM, HDMI interfaces 

• Analog & digital converters, high-speed signals 

• Power distribution and safety compliance (clearance & creepage) 

• Delivered design with differential pair routing, length matching, and full library-to-Gerber release cycle.

BROOKS 

• Designed a 10-layer PCB, managing library creation and Gerber release.

iBox & UHIL Testing Platform 

• Developed a 4-layer PCB for testing platforms, from library creation to Gerber release.

Smoke/CO (AC-Powered with Battery Backup) 

• Designed an 8-layer PCB supporting two product variants: 

• G1: Smoke-only 

• G2: Smoke + CO

• Delivered end-to-end design from library development to Gerber release.

ICELAND 

• Designed an 8-layer PCB with advanced high-speed design considerations. 

• Completed library creation and Gerber release.

iROBOT 

• Designed a 6-layer PCB, overseeing the full library creation and Gerber release process.

I hereby declare that the above details are true to the best of my belief and knowledge.