Arun T Arali

• Designed embedded hardware for defence-grade Thermal Imaging (TI) camera modules and Electro-Optical (EO) systems.
• Developed Product/System and Power Supply architectures including DC-DC buck/boost converters, LDO regulators, power sequencing, and protection circuits (eFuse, reverse polarity, surge, and over-current protection).
• Designed high-speed digital interfaces including USB 2.0/3.2, HDMI, MIPI-CSI/DSI, LVDS, SDIO, UART, SPI, and I²C.
• Selected electronic components considering military/industrial temperature range, lifecycle, availability, reliability, and cost.
• Performed signal integrity-conscious PCB routing, impedance control, differential pair routing, and high-speed length matching.
• Created comprehensive hardware design documentation, including schematics, BOM, PCB fabrication files, assembly work instructions, ATP, wiring diagrams, and design reports, ensuring clarity and consistency for manufacturing and testing.
• Performed schematic verification, PCB design reviews, and design validation prior to fabrication.
• Supported prototype bring-up, board debugging, hardware validation, and functional testing using oscilloscopes, DMMs, and power analyzers.
• Developed Acceptance Test Procedures (ATP), hardware test plans, and production test documentation.
• Investigated and resolved hardware issues throughout prototype, manufacturing, and field testing, enhancing product reliability and performance.
• Conducted component qualification, engineering change implementation (ECO/ECN), and BOM maintenance.
• Integrated thermal cameras, day cameras, display modules, storage devices, and communication interfaces into embedded vision systems.
• Collaborated with firmware, mechanical, optical, and system engineering teams during product development.
• Participated in system integration, environmental testing, and reliability validation for defence applications.
• Prepared and maintained system-level BOMs and hardware costing sheets by analyzing component, PCB fabrication, assembly, optics, cable, testing, and manufacturing costs, supporting accurate cost estimation, prototype development, procurement, and production planning.

Other Activities:

• Prepared and released comprehensive manufacturing and test documentation, including Board ATP, Unit ATP, BOM, Work Instructions, Assembly Instructions, and Test Procedure documents, ensuring quality approval and facilitating production and delivery of over 2,000 Thermal Imaging Night Vision Sights.
• Assisted manufacturing and test engineers by providing technical training, hands-on support for hardware testing and unit-level testing, and troubleshooting to ensure consistent product quality and adherence to established test procedures.

• Developed and maintained hardware test procedures, test reports, and validation documentation to ensure consistent testing and traceability.
• Executed board bring-up activities, Impedance checks, power rail verification and interface validation, during prototype evaluation.
• Performed functional testing, characterization, and tuning of CMOS image sensor evaluation boards to verify performance against design specifications.
• Conducted hardware debugging and root cause analysis of board-level failures using oscilloscopes, digital multimeters (DMM) and regulated power supplies,
• Performed precision BGA component assembly, replacement, and rework using professional BGA rework stations.
• Carried out fine-pitch manual soldering and rework of SMD components (0201/0402/0603, QFN, QFP, connectors, and passive devices) for prototype development and engineering change implementation.
• Maintained electronic component inventory and coordinated material availability for engineering builds, supporting efficient prototype assembly activities.
• Managed optical components, camera modules, image sensors, and engineering samples to ensure accurate handling, proper storage, and effective inventory tracking.
• Followed ESD-safe handling procedures and laboratory best practices to ensure reliability in testing and safeguard sensitive semiconductor devices.

• Designed embedded hardware for defence-grade Thermal Imaging (TI) camera modules and Electro-Optical (EO) systems.
• Developed product/system and power supply architectures, encompassing DC-DC buck/boost converters, LDO regulators, power sequencing, and protection circuits (eFuse, reverse polarity, surge, and over-current protection), ensuring robust performance for embedded applications.
• Designed high-speed digital interfaces including USB 2.0/3.2, HDMI, MIPI-CSI/DSI, LVDS, SDIO, UART, SPI, and I²C.
• Performed signal integrity-conscious PCB routing, impedance control, differential pair routing, and high-speed length matching.
• Performed schematic verification, PCB design reviews, and design validation prior to fabrication.
• Selected electronic components considering military/industrial temperature range, lifecycle, availability, reliability, and cost.
• Supported prototype bring-up, board debugging, hardware validation, and functional testing with oscilloscopes, DMMs, and power analyzers, contributing to successful product deployment and reliability assurance.
• Developed Acceptance Test Procedures (ATP), hardware test plans, and production test documentation.
• Collaborated with firmware, mechanical, optical, and system engineering teams during product development.

Other Activities

• Participated in Field Evaluation and Technical Evaluation trials for Thermal Imaging Night Vision Sights at defence establishments, providing technical support, system validation, and troubleshooting for tender qualification.

• Performed functional testing, characterization, and tuning of CMOS image sensor evaluation boards to verify performance against design specifications.
• Executed board bring-up activities, including impedance checks and power rail verification during prototype evaluation, utilising oscilloscopes and DMMs to validate functionality.
• Carried out fine-pitch manual soldering and rework of SMD components (0201/0402/0603, QFN, QFP, connectors, and passive devices) for prototype development and engineering change implementation.
• Performed precision BGA component assembly, replacement, and rework using professional BGA rework stations.
• Developed and maintained hardware test procedures and validation documentation, ensuring consistent testing and traceability for enhanced reliability in test outcomes.
• Managed optical components and camera modules, ensuring proper handling, storage, and calibration to maintain integrity of engineering samples and streamline inventory tracking.
• Maintained electronic component inventory, coordinated material availability for engineering builds, and supported prototype assembly activities.
• Followed ESD-safe handling procedures and laboratory best practices to ensure reliable testing and prevent damage to sensitive semiconductor devices.