Arunpandi R

• 13+ years of experience as a Thermal Mechanical Engineer, specializing in thermal management solutions for diverse applications including notebooks, gaming devices, tablets, power systems, and defense electronics. Strong knowledge in the field of thermal and fluid sciences
• Pioneered research and development at Intel Corporation, focusing on innovative thermal technologies and solutions.
• Performed detailed thermal analysis and validated simulation models through rigorous testing using natural and forced convection chambers, wind tunnels, and acoustic chambers
• Developed and optimized fan policies to enhance system performance and auditory experience.
• Developed and implemented Dynamic Thermal Throttling (DTT) policies to optimize device performance and prevent overheating.
• Automated thermal test post processing using Python to improve efficiency
• Proficient in CFD thermal modeling with tools such as Ansys ICEPACK, Flotherm, Fluent, and OpenFOAM.
• Experienced in heat sink optimization, fan selection, and feasibility studies for electronic cooling designs.
• Skilled in 3D modeling and drawing with UG NX, including preparing detailed documentation for manufacturing
• Expert in advanced thermal management for Intel CPU processors and power-dissipating components, including BGA, FCBGA, DDR3 memory, and QFN components, with extensive experience in developing cooling solutions for high-performance and critical electronic systems.
• Proficient in thermal testing using thermal data loggers and IR cameras.
• Conducted extensive flow measurements and fan characterization using wind tunnel testing.
• Demonstrated ability to resolve technical issues and recommend design improvements
• Strong communication and coordination skills, with experience working with cross-functional teams and US counterparts.

• Gold Medalist for First Rank in BE in Mechanical Engineering
• Poster presentation on “Extended fan housing Flow Architecture” at Intel Mechanical and Thermal Engineering summit 2024
• Filed patent USD802582S1-Electronic Enclosure design
• Filed patent USD807824-CPU Heat spreader
• 2 patents filled for pending

• Passport Number: Z2658592
• Father's Name: S.Radhakrishnan
• Date of Birth: 07/20/90
• Gender: Male
• Nationality: Indian
• Marital Status: Married

Thin & Light Notebook Systems - Thermal Engineer

In my role as a Thermal Engineer, I led the development of advanced thermal management solutions for thin and light notebook systems incorporating Intel's latest processors. The system was designed to dissipate 15W of heat in steady-state mode. To achieve effective heat dissipation with minimal acoustic impact, I employed MEMS-based air movers, resulting in a remarkably low noise level of 22 dBA and a passive cooling experience for users. I developed and optimized multiple thermal design concepts, selecting the best design through rigorous thermal simulations. My responsibilities included optimizing the system’s floor plan for thermal efficiency, preparing detailed design and thermal analysis reports, and conducting thermal validation using acoustic and flow measurement equipment. Additionally, I collaborated with local and overseas vendors to procure essential thermal solution components, including fans, vapor chambers, heat sinks, and thermal interface materials.

Locomotive ECU - Packaging Engineer

As a Packaging Engineer, I was responsible for designing and optimizing the thermal management of an ECU system for locomotive engines, which included a CPU and power supply board. This system required effective heat dissipation due to its high power output. I developed both conceptual and detailed 3D models to address thermal challenges, ensuring optimized heat transfer through innovative design methods. My role involved performing thermal analysis for various load cases, preparing comprehensive design and thermal reports, and selecting suitable fans, heat sinks, thermal pads, and wedgelocks. I proactively gathered input from the electronics team to align the thermal management strategy with the system's needs, ensuring that all design requirements were met and that the thermal solutions were efficient and reliable.

NG LRU - Product Design Engineer

In my capacity as a Product Design Engineer, I designed a modular line-replaceable unit (LRU) for radar applications, mounted on an ARINC tray and weighing 6 kg. The design process involved creating both conceptual and detailed 3D models based on specific customer requirements. I focused on ensuring that the LRU provided effective thermal management through careful design and analysis. My responsibilities included preparing detailed 2D drawings, design documents, and bills of material. I conducted thorough thermal analysis to validate the design’s performance, ensuring that the final product met all thermal and operational requirements. This role underscored my ability to deliver comprehensive product designs with a strong emphasis on thermal management and documentation.