Work Preference
Summary
Education
Work History
Skills
PROFESSIONAL EXPERIENCE
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Bhimappa Shekharappa Walikar

Bhimappa Shekharappa Walikar

Bangalore,KA

Work Preference

Work Type

Full Time

Summary

Mechanical Engineer | Product Design & Electronics Packaging Specialist

Mechanical Engineer with 11+ years of experience in product design, electronics packaging, rugged enclosure development, and PCB mechanical integration. Skilled across the full product lifecycle—including requirements capture, concept design, prototyping, verification, qualification, and production transfer. Specialized in product design & development, thermal analysis, finite element analysis (FEA), and integration of mechanical and electro-mechanical components for Military, Aerospace, and 5G Radio Telecom industries.

Education

Bachelor of Engineering

Vtu

Work History

Project Lead

L&T Technology Services
10.2024 - Current

• Leading mechanical design of electronics 5G Radio systems with minimum supervision.
• Coordinating with ECAD, Electrical, Reliability, and Industrialization teams.
• Ensuring compliance with internal product design processes.

Senior Design Engineer

Datasol Pvt. Ltd., Bengaluru
07.2017 - 10.2023

• Designed enclosures(defence & Avionics) and mechanical components for rugged electronics.
• Created PCB outlines, validated ECAD mechanical compatibility.
• Executed designs involving machining, sheet metal, casting, and plastics.
• Supported prototyping, environmental qualification, and production release.

Design Engineer

Tata Power SED
08.2014 - 07.2017

Design and drafting of modules and racks keeping into consideration of
ergonomics, aesthetics, strength and weight handling capability as per
requirements provided, referring to Mil standards, IS, IEC standards
and JSS55555 for missile launchers, communication shelters and
Tanks by using solid edge tool

Skills

Solid Works
Solid Edge
Cero
Thermal Analysis
Electromechanical
Mechanical Design
Engineering Change Management
Electromechanical Assemblies
CFD Analysis
3D Model
Bom Management
PLM Tools
Peer Reviews
Tolerance Stackup
Tolerance Analysis
BOM

PROFESSIONAL EXPERIENCE

1. 19” Rugged Panel PC – MIL-Qualified Conduction-Cooled Enclosure

Role: Design Engineer | Tools: SolidWorks, SolidWorks Simulation

  • Engineered a MIL-qualified conduction-cooled enclosure compatible with 19” rack and wall-mount standards.
  • Integrated heat-pipe technology to enhance thermal transport and performed detailed thermal simulations for conduction paths.
  • Defined PCB outlines, stack-ups, and component layouts for COM Express, MXM, XMC, and Mini PCIe modules.
  • Optimized internal module placement to streamline harness routing and reduce wiring complexity.
2. Dual Display Console – Modular Naval Workstation

Role: Design Engineer | Tools: solidwork

  • Designed a rugged dual-display console using a combination of precision machining and sheet metal fabrication.
  • Applied ASME Section IX welding practices to ensure structural integrity and certification readiness.
  • Delivered complete documentation including BOM, Master Drawing Index, GA drawings, and detailed part drawings with GD&T per ASME Y14.5.
  • Managed the ECR/ECN process, updating components and drawings for prototype and production builds.
  • Worked directly with customers to resolve fabrication drawing queries and improve manufacturability.
3. 3U VPX-Based IFF Signal Processor Enclosure (AEW&C System)

Role: Design Engineer | Tools: solidworks

  • Designed a rugged enclosure meeting MIL-STD-810G mechanical and environmental requirements.
  • Developed 3U VPX PCB layouts and custom backplane interfaces, coordinating closely with PCB designers.
  • Engineered a convection-cooled enclosure with optimized airflow paths and integrated high-reliability fans.
  • Ensured mechanical-to-electrical compatibility through ECAD/MCAD collaboration.
4. IP-50GP 5g Radio Assembly – Ruggedized IDU Chassis

Role: Design Engineer | Tools: SolidWorks, SolidWorks Simulation (Thermal)

  • Designed a 19” ruggedized conduction-cooled chassis meeting strict weight and protection requirements.
  • Achieved IP62 protection (IEC-60529) through optimized sealing and structural design.
  • Performed thermal calculations and simulations to validate heat dissipation performance.
  • Led end-to-end mechanical development spanning machining, sheet metal, and casting processes.
5. 4 kVA Inverter Module Assembly – Integrated Electronic Warfare System (IEWS)

Role: Design Engineer | Tools: SolidWorks, Teamcenter PLM

  • Designed enclosure compliant with IP62, EMI/EMC shielding, and random vibration requirements for rugged EW environments.
  • Created PCB outline, critical component layout, and heat-sink design with improved thermal dissipation.
  • Performed thermal and vibration analysis to validate structural integrity.
  • Developed and managed the BOM and executed release activities via Teamcenter PLM.
6. Compact Cable Gland – IP68-Rated Product

Role: Design Engineer | Tools: SolidWorks

  • Engineered an IP68-certified compact cable gland with UV-resistant design for outdoor environments.
  • Selected materials using PA66 polymer matrix to meet mechanical, sealing, and environmental requirements.
  • Managed the entire product lifecycle from concept → design → validation → production.
  • Supported the injection molding process, tooling coordination, and production release.
7. OMT & Diplexer Waveguide Design and ATE Station Development

Role: Mechanical Design Engineer | Tools: SolidWorks, CREO, HFSS (if applicable), AutoCAD

Project: RF Microwave Components & Automated Test Equipment (ATE) – Various Telecom & Communication Programs Key Contributions:
  • Designed Orthomode Transducer (OMT) and Diplexer waveguide components used in high-frequency RF communication systems for defense and aerospace applications.
  • Created precision waveguide geometries ensuring proper mode isolation, insertion loss performance, and structural rigidity for environmental compliance.
  • Coordinated closely with RF and Microwave engineers to convert electromagnetic design requirements into manufacturable mechanical models.
  • Developed 3D CAD models and engineering drawings for waveguide components including OMTs, diplexers, elbows, adapters, couplers, and flanges per MIL / IEEE standards.
  • Conducted thermal, vibrational, and structural evaluations
  • Designed mechanical architecture for ATE (Automated Test Equipment) stations, integrating electronic modules, RF switching hardware, waveguide assemblies, and test fixtures.
  • Ensured ergonomic layout of ATE stations, supporting ease of wiring, RF routing, accessibility, and maintenance.
  • Prepared complete engineering documentation, including BOMs, assembly drawings, wiring layouts, waveguide routing diagrams, and test fixture designs.
  • Supported prototype builds, RF alignment, and collaborated with manufacturing teams for machining of waveguide components with tight tolerances.
  • Managed design changes through ECR/ECN processes, ensuring traceability and compliance with PLM requirements.
Bhimappa Shekharappa Walikar