DIL KHUSH SHARMA
Ghaziabad,Uttar Pradesh
Summary
Dynamic Senior Engineer with extensive experience at Padget Electronics, specializing in advanced BGA rework and RF troubleshooting. Proven ability to lead teams and enhance repair processes, resulting in improved accuracy and efficiency. Skilled in schematic analysis and committed to fostering collaboration and strong work ethic within cross-functional teams.
Overview
8
8
years of professional experience
Work History
SR. ENGINEER (SMT, FATP Repair)
PADGET ELECTRONICS PVT LTD
Nioda
11.2025 - Current
PROJECT: COMPAL – GOOGLE PIXEL
Duration: Last 5 Months – Present
- Learned and performed advanced BGA reballing using throw-ball techniques, precise ball alignment, and controlled IC mounting.
- Developed expertise in high-precision glue cutting and underfill removal while minimizing risk of PCB pad or nearby component damage.
- Prepared and submitted detailed quality repair reports through Google Forms, maintaining proper repair traceability and defect documentation.
- Learned GNSS technology and GNSS-related troubleshooting, including signal path understanding and positioning-related hardware diagnosis.
- Worked on high-precision 5G RF band repair, including RF signal path diagnosis and component-level troubleshooting in advanced smartphone RF sections.
- Received practical training on oscilloscope operation and waveform analysis from experienced Chinese and Vietnamese technical professionals.
- Performed oscilloscope-based troubleshooting for clock, data, enable, reset, power sequencing, and communication signals.
- Performed advanced removal, reballing, alignment, and mounting of double-decker / stacked CPU IC assemblies.
- Worked with microscopic precision for BGA pad inspection, solder joint quality verification, jumper repair, trace inspection, and micro-component replacement.
- Improved fault isolation by combining schematic analysis, resistance comparison, voltage measurements, waveform analysis, and functional test results.
- Developed deeper understanding of 5G/RF architecture, GNSS signal chains, high-speed communication interfaces, and multilayer smartphone PCB technology.
- Facilitated critical failure analysis by identifying root causes and improving diagnostic precision beyond component replacement.
- Built strong cross-platform repair capabilities covering smartphone PCBA, laptop motherboards, RF sections, BGA packages, power circuits, and high-density SMT assemblies.
- Worked on WIP clearance, critical SMT failures, FATP failures, and component-level mobile phone repair.
- Conducted systematic Root Cause Analysis (RCA) for recurring manufacturing and functional defects, improving repair accuracy.
- Diagnosed and repaired critical RF section failures, including RF power path, transceiver-related faults, antenna/RF signal path issues, and abnormal network performance.
- Troubleshot download/programming section failures, including device non-detection, flashing failures, boot/download mode faults, and communication-related issues.
- Handled common SMT defects such as BGA dry solder, missing/misaligned components, solder bridging, component damage, and open/short circuits.
- Repaired FATP failures related to power-on, charging, display, camera, audio, sensors, USB, and connectivity functions.
- Supported WIP reduction by identifying repeated defect patterns and implementing effective repair routes.
- Took ownership of learning the complete laptop motherboard repair technology and process flow.
- Trained a newly formed repair team on motherboard diagnosis, component verification, rework procedures, and repair quality standards.
- Contributed to WIP clearance through structured fault analysis and repair planning, improving repair turnaround.
- Developed and standardized the process for CPU/GPU BGA reballing, mounting, alignment, thermal profile control, and post-repair verification.
- Diagnosed SMT and assembly defects including BGA soldering issues, missing components, connector damage, improper mounting, solder shorts, and open circuits.
- Worked on board-level failures involving power sequencing, VRM sections, EC/BIOS circuits, RAM interfaces, PCIe/NVMe sections, USB, display, and charging circuits.
- Performed component verification using schematics, boardview, diode mode, resistance analysis, voltage measurements, and signal tracing.
- Led technicians during critical repairs and helped maintain process discipline, repair quality, and WIP control.
- Gained technologies transferable to smartphone repair, especially BGA rework, high-density PCB diagnosis, power-sequence analysis, high-speed interface troubleshooting, and precision component replacement.
Sr. Engineer (SMT L4 Repairing)
LAVA International Pvt Ltd
Noida
10.2023 - 10.2025
- Coordinated repair, analysis, and reporting activities for the team, enhancing workflow and communication.
- Performed L4 fault repair and root cause analysis.
- Managed NPI analysis and repair tasks.
- Supported 5G work and trained a fresher on PCBA analysis process.
- Completed part verification and analysis review.
- Compiled PCBA reports for review.
- Assisted team in resolving complex problems and prepared daily shift reports.
- Compiled shift reports, highlighting operational insights and performance.
- Reviewed Calibration Logs and Analyzed PCB to find solutions at the earliest.
- Worked on 5G technology and Band frequency Oxillation.
Engineer (SMT L4 Repair).
MCM Telecom Pvt Ltd
Noida
04.2023 - 10.2023
- Analyzed SMT failures and reported QC findings to help control defects.
- Guided freshers and helped identify root causes during troubleshooting.
- Identified hardware and software issues, then worked on fixes.
- Prepared daily work reports in Excel and CRM.
PCBA Repair Technician (L4 BGA + Multi brand Phone DOA Engineer).
LRP CAPTIVATORS Pvt Ltd
08.2020 - 04.2023
- Resolved hardware and software issues in systems, ensuring operational reliability.
- Guided and trained new technicians on L4 repairs and PCBA analysis, enhancing team skill level.
- Repair inline, SMT failure and assembly failure (DL, RF, MMI).
- Preparation of daily work report and managed team of both shift A & B
- Collaborated with teams at MCM, KHY, INONE, PEDGET, and LAVA to resolve SMT failures in vendor shipments, improving product quality.
Mobile Repair Technician (L1 to L4 repairing).
Technocare Pvt Ltd (Moto & Lenovo service centre)
01.2020 - 08.2020
- Diagnosed hardware and software issues to enhance repair accuracy.
- Executed repairs on PCBA, sub PCBA, and components like touch, display, and FPC to restore device functionality.
- Developed daily job sheets to streamline task organization and improve workflow.
Mobile Repair Technician (L4, L3& L2 Service Engineer)
iQor Global Services (IVY Technology)
12.2018 - 12.2019
- Discover problem & then work on Hardware & software.
- Repair PCBA & refurbish phone.
- Preparation of daily work data.
Education
B.com -
DELHI UNIVERSITY
01-2023
Polytechnic - Electronics
01-2018
12th Class -
BSEB Board
01-2015
10th Class -
BSEB Board
01-2013
Diploma - Advance computer (ADCA)
DOT-NOT Computer
Diploma - smart phone repair Technician
DAKSYA ACADEMY
Skills
- 5G PCBA experience
- BGA rework
- Schematic analysis
- Oscilloscope analysis
- RF troubleshooting
- Troubleshooting
- Process development
- Attention to detail
- Time Management
- Team leadership
- Technical presentation
- Interpersonal communication
Personal Information
- Date of Birth: 1998-08-15
- Gender: Male
- Marital Status: Unmarried
Languages
Language Known : Hindi, English
ACTIVITIES INTEREST
Analysing problem & finding solution, Reading financial books, Playing video games, Learning new things, Analysing new problems
PERSONAL INFORMATION
- Father Name : Mr. Uday Chandra sharma
- Date of Birth: 1998-08-15
- Gender: Male
- Marital Status: Unmarried
DECLARATION
I hereby declare that the above information is true to the best of my knowledge and nothing has been concealed. Date ....................... Place ....................... DIL KHUSH SHARMA
Timeline
SR. ENGINEER (SMT, FATP Repair)
PADGET ELECTRONICS PVT LTD
11.2025 - Current
Sr. Engineer (SMT L4 Repairing)
LAVA International Pvt Ltd
10.2023 - 10.2025
Engineer (SMT L4 Repair).
MCM Telecom Pvt Ltd
04.2023 - 10.2023
PCBA Repair Technician (L4 BGA + Multi brand Phone DOA Engineer).
LRP CAPTIVATORS Pvt Ltd
08.2020 - 04.2023
Mobile Repair Technician (L1 to L4 repairing).
Technocare Pvt Ltd (Moto & Lenovo service centre)
01.2020 - 08.2020
Mobile Repair Technician (L4, L3& L2 Service Engineer)
iQor Global Services (IVY Technology)
12.2018 - 12.2019
B.com -
DELHI UNIVERSITY
Polytechnic - Electronics
12th Class -
BSEB Board
10th Class -
BSEB Board
Diploma - Advance computer (ADCA)
DOT-NOT Computer
Diploma - smart phone repair Technician
DAKSYA ACADEMY