Divya MADAM

To pursue my knowledge for growth of the industry. Take-over the challenges within the field. Explore into object-oriented fields, and upgrade myself to new technologies emerging in the professional field.

• SSC, Board of Secondary Education, 2007
• Electronics Technician, SreeVidya institute for vocational courses, 6 months, 2007

• Father's Name: M.Sangameshwar
• Date of Birth: 11/08/90
• Gender: Female
• Nationality: Indian
• Marital Status: Married

• Hands free experience in assembling of critical SMD components like 01005, 0201, 0402, 0603, 0805, 1206, 1210 ext..
• Experienced in PCB wiring, rooting, relay hock wiring and turret soldering.
• Working knowledge in soldering of SMA Connectors, BNC Connectors & N Connectors.
• Soldering of Multi Leaded IC Packages like BGA, TFBGA, FPGA, SOIC, SPLCC, TQFP, MSOP & QFN ext..
• Pop + MEMORY IC'S Stacking and Soldering of SRAM, NAND, ASIC, FLASH Memory.
• Hands-on experience in placing & Reballing activities of BGA, HBGA, LFBGA, TFBGA, VFBGA etc., by using the equipment’s.
• Handling bring ups support on 'new platform and chips.
• Enablement of Mobile and, Development boards and etc...., for the power and performance and thermal data collection.
• Supporting to System teams and analysis team for Platform side.
• Understanding the intricacies of assembling different types of PCBs is essential. Each board has its unique challenges.
• Ability to rework and repair printed circuit boards to specification and customer satisfaction is commendable. It’s like performing surgery on electronics.
• Customer Devices Support like SAMSUNG, XIOMI, MOTO, Honor, OPPO, Vivo, Redmi
• Maintaining Inventory & stocks for present projects.
• Understanding schematics.

• Fine Tech CR 10 BGA Rework station operations& ERSA HR600.
• WDS700 Machine station operations.
• Pro-Zoom SZ4.5 Prolite Micro Scope.
• Silicon Grinding Tool.