Summary
Overview
Work History
Education
Skills
Timeline
Generic

DURGA LAKSHMANAN

Failure Analysis
Tamilnadu

Summary

Results-driven Failure Analysis Technician with expertise from Foxcorn Han Hai Technology, skilled in root cause analysis and leadership. Proven track record in enhancing motherboard quality through effective troubleshooting and 5 Why analysis. Adept at using advanced diagnostic tools, fostering team development, and achieving production targets while ensuring compliance with industry standards.

Overview

7
7
years of professional experience

Work History

Failure Analysis Engineer

Foxcorn Han Hai Technology India Mega Development Pvt Ltd
05.2023 - Current
  • Analysis of the failure motherboard from SMT Line and give the root cause to the board.
  • Handling the digital oscilloscope,X Ray Machine,microscope DC Source,Multimeter,Spectrum analyzer Thermal imager and LIT Machine.
  • Knowledge of analysis AP and PF Fail.
  • Reporting process related issues to production/quality daily to avoid repeated problems.
  • Achieve daily targets as per plan.
  • Guiding and training the team members with defect boards to improve the analytical skills.
  • Give the root cause for the new feature symptoms.
  • Make a record for failure analysis status and provide feedback to internal cross function teams.
  • Use 5 Why analysis to give the RCCA (Root Cause and Corrective Action).
  • Handling of NPI Products and support to ramp up.
  • Follow 5'S and ESD Activities.
  • Our project aim to provide a good quality motherboard to the customer and maintain a good yield in our repair.

Production Line Worker

Sanmina India Private Limited
10.2020 - 02.2023
  • Failure analysis on PCBA Rejected from SMT line and functional testing to isolate fault component process are handling levels.
  • Executed systematic troubleshooting using multimeter, schematic and board layouts to trace opens,shorts and incorrect voltage level.
  • Analyzed comman SMT Failure modes including tombstoning,solder bridged,lifted pads and components misalignment.
  • Conducted component leave failure analysis by verifying polarity , value and functionality of ICs,MOSFETs,registers and capacitors.
  • Correlated AOI-FVMI defect data with reflow profiles and pick and place logs to identify process related failure trends.
  • Verified repeatability of failure by recreating defects condition to confirm root cause before initiating and prevent recurrence.
  • Generated failure analysis report with defect photos,electrical test data & root cause findings per IPC-A-610 Standards.
  • Documented all failure modes using 5why analysis for traceability and continuous improvement.

Process Data Analyst

SK Technologies
07.2019 - 09.2020
  • BBO Non voice professional with experience in EDU US Education process handling students email supports.
  • Dta processing and enrollment operations in sales force while ensuring FERPA Compliance.

Education

Bachelor of Engineering - ECE

ANNAI COLLEGE OF ENGG & TECHNLOGY
Kumbakonam, India
04.2001 -

HSCC -

KITTAPPA MPL HIGHER SECONDARY SCHOOL
Mayiladuthurai, India
04.2001 -

Skills

MS EXCEL

FAILURE ANALYSIS

LEADERSHIP

ROOT CAUSE ANALYSIS

Timeline

Failure Analysis Engineer

Foxcorn Han Hai Technology India Mega Development Pvt Ltd
05.2023 - Current

Production Line Worker

Sanmina India Private Limited
10.2020 - 02.2023

Process Data Analyst

SK Technologies
07.2019 - 09.2020

Bachelor of Engineering - ECE

ANNAI COLLEGE OF ENGG & TECHNLOGY
04.2001 -

HSCC -

KITTAPPA MPL HIGHER SECONDARY SCHOOL
04.2001 -
DURGA LAKSHMANANFailure Analysis