George Lukose

• Enabled Foundry partners based on technology nodes and product requirements for semiconductor front-end manufacturing.
• Enabled OSAT partners based out of Taiwan, Malaysia, China, and India for semiconductor packaging, testing, and qualification.
• Streamlined supply chain management to reduce costs and improve efficiency.
• Established relationships with vendors and suppliers to secure favorable terms for materials or services.
• Responsible for supplier selection, planning, forecasting, materials, and manufacturing, including product testing.

• Developed project plans, identified risks, set objectives, monitored progress towards completion, and aligned with budget and schedule.
• Oversaw the resolution of issues and challenges impacting program delivery, facilitating problem-solving and decision-making processes. Chaired the PDT, which is responsible for product concept definition to high-volume manufacturing, covering all aspects of the product life cycle from proto builds to power-on to validation to HVM.
• Led cross-functional teams to deliver innovative solutions to achieve program milestones. Mentored junior team members. Managed approximately 50 cross-functional/cross-geo teams, including board development, layout, electrical, power, thermal, mechanical, manufacturing, materials, and deployment.
• Facilitated change management processes, supporting the organization and stakeholders through program transitions.
• Managing design ODM houses and outsourced manufacturing facilities for product execution, setting up ODM/CM houses for NPI builds, followed by HVM ramp.
• Manufacturing feasibility for the BOM, custom parts, and newly enabled components.
• Supply chain feasibility analysis for the BOM, custom parts, and newly enabled components.
• NPI manufacturing and high-volume manufacturing strategy: working very closely with OEMs and ODMs.
• Owns the project (Design, Manufacture, and Demand to Deployments) and includes coordination/stakeholder management with internal customers, design team, material team, manufacturing team, and supplier to ensure project implementation as per time and cost guidelines.
• Tracks platform issues and owns closing them with stakeholders.
• BOM release management, including ECO/ACO control and BOM lead time analysis.
• Handled a $50M budget a year, approves budget approval, and maintains tracking.
• Negotiated contracts, supplier audits, and conducted yearly price reduction and performance monitoring sessions with suppliers, and negotiations to meet cost targets.

Global Supply Chain Program Manager.

• Developing an India-based manufacturing ecosystem for Intel.
• Qualifying and setting up EMS/ODM capacity for strategic high- and low-volume product manufacturing.
• Hiring, ramping, and leading the engineering team at GSC India for ODM enabling and HVM manufacturing.
• Planning the engineering and supply chain strategy to develop an India-based supplier ecosystem for Intel.
• Proactively proposed, audited, and qualified a manufacturing facility out of Bangalore, which now supports a couple of lines/products, with significant cost savings.
• Triggered localization of mechanical parts in order to achieve cost targets.

• NPI lead for new product development.
• Handling manufacturing operations and material planning for a $12 million business plant, leading a team of over 50 technical operators and 5 engineers.
• Manufacturing Process Design, Analysis, and Improvement
• Hands-on experience in electronic manufacturing as a process engineer.
• Coordinating the Production, Planning, Logistics, Equipment, and Facility Maintenance team to meet the business target.