HARIBABU S
Banglore
Summary
Engineering professional with 7+ years of experience in Electronics Manufacturing specializing in Engineering Change Management (ECM), BOM governance, and Product Lifecycle Management. Proven expertise in SAP, PLM systems, and cross-functional coordination to drive accurate EBOM structures, inventory optimization, and smooth NPI transitions. Experienced in supporting global manufacturing teams at LAM Research and Samsung to implement change orders, reduce excess inventory exposure, and maintain BOM integrity.
Overview
8
8
years of professional experience
Work History
Product Change Analyst-2
RGBSI–LAM RESEARCH
08.2023 - Current
- Conduct material availability analysis, demand assessment, and evaluate long lead-time components to define Configuration NHA effectivity dates and Obsolescence (OB) timelines.
- Perform Excess & Obsolete (E&O) inventory assessments aligned with change order strategy, prioritization, and business unit requirements.
- Execute re-assessment of material impact and collaborate with Manufacturing / PCA teams to flip demand, rework sales orders and OBOM, ensuring effective inventory mitigation and cost reduction.
- Coordinate with suppliers and global manufacturing sites to manage excess inventory, and secure liability agreements for obsolete and destructured parts (Mitigation / Rework / Scrap scenarios).
- Partner with Product Managers, Change Originators, and ECPM teams to validate, align, and obtain approval for E&O exposure and mitigation strategies.
- Drive inventory disposition actions for impacted change orders, including Component scrap, Rework / reuse, Supplier payout / liability recovery, PO cancellation or conversion for obsolete / destructured parts.
- Collaborate closely with Supply Chain, Buyers, and Spares Planning teams to ensure smooth execution of inventory strategies and minimize financial impact.
- Work with Buyers and Project Services teams to validate handoff processes, cost structures, and procurement readiness for newly released and production-released components.
Associate Engineer(R&D) - BOM& ECN management
SAMSUNG INDIA ELECTRONICS PVT.LTD.
07.2021 - 07.2023
- New Model development(NPI) BOM creation, understanding overall operations of BOM, timely configuration and enhancing the accuracy of the BOM
- Managed complete ECM lifecycle (ECR, ECO, ECN), ensuring accurate documentation, approvals, and timely implementation.
- Acted as a central BOM governance point, coordinating with manufacturing, supply chain, Buyers, Product managers and program teams to close BOM discrepancies.
- Conducted ECM meetings with cross-functional teams and communicated engineering change points to production and to resolve BOM errors.
- Implemented 3-Point and Specification Matching by validating PLM data, drawings, and actual product samples for Pre-production BOM validation builds.
- Supported in Benchmarking for value engineering, cost reduction, and part communization initiatives using drill-down analysis.
- Managed new part code generation, configuration validation, and CIS system updates to ensure lifecycle accuracy.
Product Development (NPD) - Junior Engineer
FOXCONN TECHNOLOGY INDIA PVT. LTD.
02.2018 - 02.2021
- Executed design modifications in Creo to meet customer requirements and ensure manufacturable, cost-effective solutions.
- Developed accurate BOM sand routings using PLM-Agile and SAP to support NPD workflows.
- Prepared drafting and detailing packages for new in-house production projects and supported ECN-driven updates for existing products.
- Contributed to product development, troubleshooting, and enhancement initiatives to improve performance and customer satisfaction.
- Applied expertise in sheet metal design, stamping processes, and powder coating to optimize new product manufacturability.
- Supported NPD cycles through sample submission, PPAP activities, and customer design interpretation.
- Created Process Flow Charts (PFC) aligned with customer BOM sequences and NPD requirements.
- Directed vendor development, part qualification, and conducted supplier process audits for new project introductions.
Education
B.E. - MECHANICAL
PANIMALAR INSTITUTE OF TECHNOLOGY
Chennai, India01-2017
HSC - undefined
NAZARETH MATRICULATION HIGHER SECONDARY SCHOOL
Chennai, India01-2013
Skills
- PLM (Team center), UGNX, AutoCAD, SAP (PP/MM), Agile PLM
- BOM Management (EBOM, MBOM, FBOM), ECM (ECR, ECO, ECN), Inventory Management, Supply Chain Management
- Microsoft Office Suite, Power BI, Qliksense
- Google Project management (Foundation)
Accomplishments
- Collaborated with cross-functional and supply chain teams to minimize $650K in Excess & Obsolete (E&O) inventory by implementing effective change order strategies and material disposition planning.
- Successfully delivered 2 NPI programs for Nokia involving 200+ sub-assemblies, ensuring BOM readiness, configuration accuracy, and smooth transition to mass production.
- Supported NPI-to-production ramp for 9 programs (8 for Nokia and 1 for Bloom Energy) by coordinating engineering changes, supply chain readiness, and production launch activities.
LANGUAGES
Kannada, Tamil & English
Disclaimer
I do hereby declare that the above furnished information is true to the best of my knowledge and belief.
Timeline
Product Change Analyst-2
RGBSI–LAM RESEARCH
08.2023 - Current
Associate Engineer(R&D) - BOM& ECN management
SAMSUNG INDIA ELECTRONICS PVT.LTD.
07.2021 - 07.2023
Product Development (NPD) - Junior Engineer
FOXCONN TECHNOLOGY INDIA PVT. LTD.
02.2018 - 02.2021
HSC - undefined
NAZARETH MATRICULATION HIGHER SECONDARY SCHOOL
B.E. - MECHANICAL
PANIMALAR INSTITUTE OF TECHNOLOGY