Summary
Overview
Work History
Education
Skills
Timeline
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HARSHA MAHADEVAIAH

BENGALURU

Summary

  • 12+ years in hardware board design, development, manufacturing, and deployment.
  • Proficient in mixed signal and power HDI board subsystems for mobile, AR, XR, compute, and auto.
  • Hands-on experience in PMIC die floor planning, BGA assignments, and packaging (WLP, FC, SiP/MEP) to meet system and business requirements.
  • Hands-on experience in PCB floor planning, stackup definition (HDI and non-HDI), component placements, power, and high-speed clock routing Gerber tapeouts.
  • Proficient in 2.5D and 3D solvers for PDN extractions, RLC extractions, IR drop simulations, visual CAD reviews for tapeouts, debugging during board bring-ups, and defining new PCB guidelines.
  • Hands-on experience in electronic component selection to meet necessary PCB/PKG real estate, SoC performance, and system efficiency as per the specifications of the IPs.
  • Proficient in BoM optimization based on the area, cost, and performance, depending on the business unit.
  • Can do schematic entry, circuit simulation, schematic, and PCB library creation. Experience with board bring-up, testing, debugging, and documentation.
  • Hands-on expertise in Buck converters, LDOs, 5G clock drivers, AMOLED drivers, battery (primary and parallel chargers), haptic drivers, power MOSFETs, gate drivers, impact and thermal printers, relays, USB repeaters, etc.
  • I have led and mentored teams across the globe, managing and providing technical guidance and support.
  • Hardworking, team player, and fun-loving person with patience and eagerness to solve PCB problems.

Overview

17
17
years of professional experience

Work History

Staff Engineer

Qualcomm India Pvt. Ltd.
07.2019 - Current
  • Asia PMIC hardware lead defining and integrating PMICs for mobile, AR, XR, compute & auto.
  • Primary responsibility: Define PMIC reference PCB guidelines, schematics and BoM.
  • Secondary responsibility: Review, guide and mentor customers across globe on their schematics and PCBs to adhere PI & SI requirements laid down by our team are met.

Module Lead

Continental Automotive Components India Pvt. Ltd.
12.2017 - 07.2019
  • Worst case circuit analysis of Buck converters for window breaker ECU

Senior Executive Engineer

Crompton Greaves Automation (ZIV Automation India)
12.2015 - 12.2017
  • Hardware design and deployment of self-powered IEDs for Substation Automation

Senior Hardware Engineer

Optipace Technologies
09.2014 - 10.2015
  • Hardware Re-design of memory for Handheld Smart PoS machines

Hardware Consultant

Telegnosis Pvt. Ltd.
05.2014 - 08.2014
  • System design to control the position of BLDC motors in a robotic surgical tool.

Research Assistant

Fraunhofer IMS
04.2013 - 04.2014
  • Part time research assistant for hardware design of 13.56MHz glucose transponder

Hardware Engineer

Geodesic Limited
07.2008 - 09.2011
  • Hardware Development for Handheld Smart PoS machines (GEOAMIDA)

Education

Master of Science - Automation and Robotics

Technical University of Dortmund
Dortmund, Germany
01.2014

Bachelor of Engineering - Electronics and Communications

B.M.S College of Engineering
BENGALURU, INDIA
06.2008

Skills

  • Mentor Xpedition
  • Ansys PSI
  • Ansys Q3D
  • Cadence Sigrity Power SI
  • Cadence Sigrity Power DC
  • Cadence Allegro
  • Cadence CiS
  • Altium
  • ADS Keysight
  • LTspice
  • Microsoft Visio
  • MATLAB
  • Optimization Toolbox
  • Soldering
  • Re-working
  • MSO
  • Signal Analyzer
  • RLC meter

Timeline

Staff Engineer

Qualcomm India Pvt. Ltd.
07.2019 - Current

Module Lead

Continental Automotive Components India Pvt. Ltd.
12.2017 - 07.2019

Senior Executive Engineer

Crompton Greaves Automation (ZIV Automation India)
12.2015 - 12.2017

Senior Hardware Engineer

Optipace Technologies
09.2014 - 10.2015

Hardware Consultant

Telegnosis Pvt. Ltd.
05.2014 - 08.2014

Research Assistant

Fraunhofer IMS
04.2013 - 04.2014

Hardware Engineer

Geodesic Limited
07.2008 - 09.2011

Master of Science - Automation and Robotics

Technical University of Dortmund

Bachelor of Engineering - Electronics and Communications

B.M.S College of Engineering

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HARSHA MAHADEVAIAH