Summary
Overview
Work History
Education
Skills
Timeline
Awards
Technical Skills
Generic

KARUPPURAJA M

Bengaluru

Summary

Results-oriented Senior PCB Design Engineer with over 5 years of experience specializing in high-complexity Printed Circuit Board design and development. Proven track record of independently managing more then 30 projects, ranging from 2 to 30 layers, utilizing Allegro PCB Designer and Orcad Capture. Expert in high-speed interfaces (DDR3/4, USB 3.0 and Ethernet), impedance control, RF and Mixed Signal design

Overview

5
5
years of professional experience

Work History

Senior PCB Design Engineer

Sanlayan Technology Private Limited
Bengaluru, Karnataka
08.2025 - Current
  • Led 10 pluse PCB design projects from concept to production, ensuring compliance with industry standards
  • Successfully managed multiple projects simultaneously, ensuring on-time delivery without compromising quality
  • Mentored junior engineers in design software and best practices for efficient workflow management
  • Collaborated with cross-functional teams to integrate electrical designs into overall product development
  • Managed the full PCB design lifecycle from schematic creation and net-list generation to footprint development, component placement, and final Gerber release for manufacturing
  • Defined and implemented critical routing constraints covering physical, spacing, Manufacturing and electrical parameters to meet 45Ω, 50Ω, 90Ω, and 100Ω impedance requirements
  • Performed DFM/DFA validation and prepared manufacturing deliverables including FAB drawings, BOMs, Gerber files, and assembly documentation
  • Collaborated closely with clients to identify and resolve design issues, ensuring clear requirement alignment and smooth project execution

PCB Design Engineer

Caliber Interconnect Solution Pvt Ltd
Coimbatore, Tamil Nadu
04.2021 - 07.2025
  • Led end-to-end design of 20 pluse High Speed and Mixed signal layouts, ensuring strict adherence to signal integrity and manufacturability standards
  • Designed high-density interconnect (HDI) boards with device pitches as fine as 0.7mm using hybrid stack-ups
  • Executed complex routing for high-speed interfaces including DDR4 (fly-by topology), USB 3.0, Ethernet and high-current power boards
  • Managed the full PCB design lifecycle from schematic creation and netlist generation to footprint development, component placement, and final Gerber release for manufacturing
  • Defined and implemented critical routing constraints covering physical, spacing, Manufacturing and electrical parameters to meet 45Ω, 50Ω, 90Ω, and 100Ω impedance requirements
  • Performed DFM/DFA validation and prepared manufacturing deliverables including FAB drawings, BOMs, Gerber files, and assembly documentation
  • Collaborated closely with clients to identify and resolve design issues, ensuring clear requirement alignment and smooth project execution
  • Successfully managed multiple projects simultaneously, ensuring on-time delivery without compromising quality

Education

Bachelor of Engineering (B.E.) - Electronics and Communication

Government College of Engineering
Tirunelveli
04-2021

Skills

  • Allegro PCB Designer
  • OrCAD Capture with CIP Management
  • CAM350
  • Inter-cad Reader
  • View Mate
  • Polar SI

Timeline

Senior PCB Design Engineer

Sanlayan Technology Private Limited
08.2025 - Current

PCB Design Engineer

Caliber Interconnect Solution Pvt Ltd
04.2021 - 07.2025

Bachelor of Engineering (B.E.) - Electronics and Communication

Government College of Engineering

Awards

CALIBER :-

  • Spot Award(2024), Recognized for completing high-complexity designs with superior quality
  • Caliber-BRAVO Award(2023), Received for exceptional client appreciation and service
  • Rising Star Award(2021-2022), Recognized for outstanding performance during first year of tenure

SANLAYAN :-

  • Spot Award(2026), Recognized for Player a key role Across multiple Critical programs, include Channel Simulator, RFSoC, S and L Band SSPA Projects

Technical Skills

DFM, DFA checking, Different Impedance Calculation, DDR3, DDR4, DDR5, USB 3.0, Ethernet, LVDS, RGMI, Different Via Concepts(Through hole, Blind and Buried vias), Multi-layer Design with Hybrid Stack-ups, RF Design Concepts, High Speed Design Concepts and Mixed-Signal Design Concepts

KARUPPURAJA M