Skilled in Analog Layout Design Engineering with focus on developing complex analog and mixed-signal integrated circuits. Strong background in various technologies including CMOS. Understands design rules, device matching, low power techniques, parasitic reduction strategies and floor planning. Proven track record of optimizing designs for performance, manufacturability and testability.
Overall, 11+ years of Industry experience
English, Hindi, Kannada & Telugu
Medusa DDRSSB RX Macros
Client: AMD
Technology: TSMC N3
Duration: 3 Months
Responsibilities:
N3P is a technology where 2 different std cell height devices will be placed in
combination in the macros
POC for RX domain which has 4 macros consists of DDR & SDR for CLK & DATA paths
and 2 DECAPS
Meeting DECAPS requirements
Floorplan, Placement, Routings and LV cleanup for SSB Rx Macros.
Taking care of matching & shielding for CLK routings
Worked on standard custom cells.
Multiple bits Bump placement with PHYLET routings
Badri DDRSSB RX Macros
Client: AMD
Technology: TSMC N7
Duration: 1 year
Responsibilities:
POC for RX domain which has 4 macros consists of DDR & SDR for CLK & DATA paths
and 2 DECAPS
Floorplan, Placement, Routings and LV cleanup for SSB Rx Macros.
Meeting DECAPS requirements
Worked on standard custom cells.
Multiple bits Bump placement with PHYLET routings
Navi4x DDRSSB DLL Macros
Client: AMD
Technology: TSMC N5
Duration: 3 Months
Responsibilities:
Floorplan, Placement, Routings LV cleanup for SSB Macros.
Worked on standard custom cells.
PHYLET tasks where bumps connected
Aria 6nmRF
Client: Qualcomm
Technology: TSMC N6 RF
Durations: 6 Months
Responsibilities:
PLL Charge Pump & other PMU ctrl blocks - Floorplan, Placement, Routings LV cleanup for the required blocks.
Following of Layout constraints and verification's checks to meet the layout quality
Communications with designers/leads for any layout impacts w.r.t design changes and review for better layout improvements
Ownership for the digital blocks for all lib cells
Concerto PMU
Client: Qualcomm
Technology: TSMC 22nm RF
Duration: 6 Months
Responsibilities:
PMU (SMPS & ADDA interface block’s) - Floorplan, Placement, Routings & LV cleanup for all the required blocks.
Following the Layout constraints and verifications checks to meet the layout quality
Communications with designers for design changes updates and review for better layout improvements
MDLL CBB for OLC IP
Client: Intel
Technology: TSMC N3
Duration: 1.5 years
Responsibilities:
Floorplan, Placement, Routing for all tires of blocks till CBB level
Layout verification (LV Bundle) Clean up till PROD release
LEF generation and RV check (IR drop and EM)
Matching and Shielding constraints for critical nets
LCO’s and ECO’s improvements based on the designer requirements for enhancing
the performance of the cell.
Challenges:
TSMC introduced 3nm and we are the 1st batch in the company to work under this
node and faced very challenges in every step starting from the floor plan due to new layers and pdk.
Worked on many test cases on the abutment of the different height and different
potentials cells to clean up the violations w.r.t horizontal, vertical cell abutments as 3t, 4t are the real challenges.
Placements of all sub-blocks were inter-dependent on each other, so it was very
important to come up with a placement which satisfies all aspects
Complete IR and EM fixes were very important for the Final PROD release.
MDLL & TX CBB for SRF IP - Sierra Forrest (Duration 1 year)
Client: Intel
Technology: TSMC N3
Duration: 1 year
Responsibilities:
Floorplan, Placement, Routing for all tires of blocks
Layout verification (LVS and DRC, ERC) Clean up till PROD release
LEF generation and RV check (IR drop and EM)
Matching and Shielding requirements for critical nets
LCO’s and ECO’s improvements based on the designer requirements
Challenges:
Since SRF is our 2nd project under TSMC 3nm node and we have used some of the CBB’s used in OLC by adding the new AIP’s
Re-floorplan of the existing CBB’s without changing the size of the cell and adding of new AIP block fitting inside the CBB and routing changes with respects to new nets
Maintaining layout standards to meet the RV
GPIO
Client: Intel
Technology: TSMC 10nm
Duration: 4 Months
Responsibilities:
Floorplan, Placement, and routing of sub cells.
Layout verification – LV Bundle clean up
Layout quality checks
Internal Project (Duration 6 months)
Description: This project was carried out internally for training purpose under Intel
7nm Technology where we need to be clean up LV bundle within the timeline by
meeting the given constraints.
Responsibilities:
Floorplan, Placement, and routing of the cells
LV Bundle cleanup
Matching and Shielding constraints
Challenges:
As part of L2 training, we took the challenges of completing the given block from scratch level to LV bundle cleanup
Major constraints were to follow delay cells and maintain same routing distance between the delay cells for parasitic balancing.
Layouts of individual cells top level integration of all these cells done
Project Name: “Human Machine Interface (HMI)”
Project Description: To develop a Human machine interface using the advance image processing technique in the Real-time environment. This is done using the palm movement and without pressing any buttons. This kind of human machine interfaces would allow a human user to control remotely through hand gestures a wide variety of devices.
CMOS VLSI Level 1 training under Eklakshya using UMC 180nm Technology for the period of 6 months
I hereby, declare that the above-mentioned information is correct up to my knowledge and I bear the responsibility for the correctness of the above-mentioned particulars.