Reading Gk (Technical)
Nandhini Perumal
ELECTRICAL AND ELECTRONICS ENGINEERING
Chennai
Summary
MLB Failure Analyst specializing in precision hardware diagnostics and root cause isolation of high-density PCB anomalies. Proficient in electrical instrumentation (oscilloscopes, curve tracers) and non-destructive material analysis to resolve power rail shorts, RF degradation. Focus on your academic achievements, technical skills, and eagerness to contribute.
Overview
2
2
Languages
4
4
years of professional experience
Work History
Failure Analyst(FAE)
TATA ELECTRONICS
04.2025 - Current
- Identified failure symptoms, error codes, and testing station details (e.g., In-Circuit Test, Functional Test) to guide troubleshooting.
- Visual Inspection: Inspect the MLB under a high-magnification digital microscope. Look for obvious external defects like missing capacitors, physical cracks, liquid ingress, or burn marks.
- Measured resistance across key test points, capacitors, and power rails using a digital multimeter to locate circuit path abnormalities.
- Schematic Mapping: Open the PCB layout and schematic files to Trace the failing net across the board layout to pinpoint the exact components connected to the failing line.
- Root cause Analysis: Carefully remove the suspected failing component using a precision hot-air rework station. Re-test the board to see if the short disappears.
- X-Ray/CT Scan: Use a 2D or 3D X-ray system to look through the multi-layer High-Density Interconnect (HDI) PCB. Check for bridged solder joints, misaligned Ball Grid Arrays (BGAs), or internal trace cracks.
- Interface with other departments to ensure that failure-related issues are being addressed and improved
- Make decisions in an independent mode, if necessary.
- Documented complete failure mechanism, root cause, and verification steps to ensure accurate reporting and future reference.
RF Testing & FAE
Foxconn
12.2022 - 02.2025
- Executed RF conductive and over-the-air (OTA) testing for Cellular (5G sub- 6GHz/mmWave, LTE), Wi-Fi (6E/7), Bluetooth,RX,TX.
- iPhone manufacturing,RF ( Radio Frequency) testing station to rapidly and accurately measure parameters like signal strength, frequency error, and harmonic distortion during the production of smartphones.
- Margin level Failure Symptom should be corrected using CPK(process capability index)Fixture.
Education
Advanced Java Developer - Diploma in Java
CADD Centre
Chennai02-2025
B.E. - ECE
SRI College Of Engineering & Technology
Vandavasi 01-2019
12th -
Sannathi Hr Secondary School
Vandavasi 01-2015
10th -
Sannathi Hr. Sec School
Vandavasi 01-2013
Skills
Component-Level Diagnostics
Schematic Analysis
Electrical Measurement
Root cause analysis
Technical Communication
Team Coordination
Excel knowledge
Adaptability
MS Excel
Documentation and reporting
Issue identification
Interests
Aari work design
Listening Music
Games
Craft work
Disclaimer
I hereby declare that all the information given above is true and correct to the best of my knowledge
Timeline
Failure Analyst(FAE)
TATA ELECTRONICS
04.2025 - Current
RF Testing & FAE
Foxconn
12.2022 - 02.2025
Advanced Java Developer - Diploma in Java
CADD Centre
B.E. - ECE
SRI College Of Engineering & Technology
12th -
Sannathi Hr Secondary School
10th -
Sannathi Hr. Sec School