I would like to work in an organization that will give me a platform to utilize my technical skills and enrich my knowledge in the process to help in corporate growth with my initiative and managerial skills.
Project Name : Ikshvaku
Technology : 6nm TSMC, 14 metal layers
Tools : ICC2, Start RC and Primetime.
Macro Count : 40,45
Instance Count : 1.5M& 1.M
Frequency : 2 GHz
Dimensions : Rectangular and rectilinear
Role : Responsible for Block Level P&R Implementation Handled Two blocks from floorplan -to-GDSII (floor planning, Placement, CTS, Routing) and performed all block level sign-off checks Block level in 6nm Technology, TSMC
Project Name : ArdenC0
Technology : 6nm TSMC, 11 metal layers (2RDL layers)
Tools : ICC2, Start RC and Primetime.
Macro Count : Perfro Macro
Instance Count : 1.1M& 1.3M (smu & vdci tiles)
Frequency : 2.24 GHz
Role : Responsible for Block Level P&R ImplementationHandled Two blocks from floorplan -to-GDSII (floor planning, Placement, CTS, Routing) and performed all block level signoff checks
Project Name : MI300
Technology : 6nm TSMC, 13 metal layers (2RDL layers)
Tools : ICC2, Start RC and Primetime
Macro Count : 36
Instance Count :212k & 448k (Two smu & one io tiles)
Frequency : 2GHz
Client : INTEL
Technology : 10nm sdg74, Intel foundry with 14 Metal layers + RDL layer
Tools : ICC2, Start RC and Primetime
Role : Responsible for Block Level P&R Implementation
Instance Count : 1.5 million (1 Sub system)
Frequency : 1.8GHz Responsibilities:
Client : AMD
Technology : 7nm with 14 Metal layers
Tools : ICC2, Start RC and Primetime
Role : Responsible for Block Level P&R Implementation
Macro Count : 24
Instance Count : 925k, 724k (Two Soc tiles)
Frequency : 1.2 GHz
63 Years of experience in Physical Design and Responsibilities are taking the blocks from Floorplan to GDSII and perform block-level sign-off checks like Timing analysis, EM and IR Fixing
Have sound expertise on Floor Planning, Power Planning, IR Drop Analysis, Place and Opt, CTS,Routing, Extraction and Signal Integrity
Experience in lower technology nodes such as TSMC 6nm, 7nm and able to handle complex designs with multi million gates and tens of macros
Good at debugging and analyzing critical timing paths before hand and take care of those paths with appropriate implementation techniques
Have experience in STA, timing Eco's, functional Eco's, metal Eco's implementation
Have hands on experience in DRC, LVS, DRV fixes, Glitches, Antenna and IR/EM fixes
Working Knowledge on UNIX