Summary
Overview
Work History
Education
Skills
Contact
Personal Information
Education
Disclaimer
Timeline
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Niveditha Puskuri

Physical Design Engineer
Hyderabad

Summary

I would like to work in an organization that will give me a platform to utilize my technical skills and enrich my knowledge in the process to help in corporate growth with my initiative and managerial skills.

Overview

7
7
years of professional experience
7
7
years of post-secondary education

Work History

Member of Technical Staff

Modernize Chip Soutions
09.2024 - Current

Physical Design Engineer - II

Appex Semiconductor (AMD-Client)
07.2023 - 07.2024

Project Name : Ikshvaku

Technology : 6nm TSMC, 14 metal layers

Tools : ICC2, Start RC and Primetime.

Macro Count : 40,45

Instance Count : 1.5M& 1.M

Frequency : 2 GHz

Dimensions : Rectangular and rectilinear

Role : Responsible for Block Level P&R Implementation Handled Two blocks from floorplan -to-GDSII (floor planning, Placement, CTS, Routing) and performed all block level sign-off checks Block level in 6nm Technology, TSMC

  • Handled PnR flow from Floorplan to Routing and ECOs
  • As block is congested, tried different experiments like,partial blockages,keeping congestion effort as high. and hard blockages at notch areas prevent the shorts and DRC’s
  • As timing is critical for hold, I have performed clock pulling experiment by keeping less target latency at clock macro pins
  • I got a chance to learn about utilization and congestion issues and methods to control them
  • Techniques like w.r.t timing we tried with group path and CCD in PNR
  • To Met timing, planned multiple techniques like skewing, manual routing to reduce tran, up sizing/down sizing the cells, removing/adding buffer where it is required by checking the margins of timing paths
  • Fixed IREM violations by different techniques like cell padding , manually moving the cells,adding buffers on route, splitting the fan out and manual routing techniques.

Physical Design Engineer

AdeptChips Service Pvt Ltd (AMD-ODC)
10.2020 - 07.2023

Project Name : ArdenC0

Technology : 6nm TSMC, 11 metal layers (2RDL layers)

Tools : ICC2, Start RC and Primetime.

Macro Count : Perfro Macro

Instance Count : 1.1M& 1.3M (smu & vdci tiles)

Frequency : 2.24 GHz

Role : Responsible for Block Level P&R ImplementationHandled Two blocks from floorplan -to-GDSII (floor planning, Placement, CTS, Routing) and performed all block level signoff checks

  • As block is voltage dominated , so creating of primary and secondary power domains is challenging thing , tried different experiments like multiple power domains by changing the keeping congestion clean
  • As timing is critical for hold, I have performed clock pulling experiment by keeping less target latency at clock macro pins
  • I got to learn about utilization and congestion issues while creating the voltage domains
  • To Meet timing, planned multiple techniques like skewing, manual routing to reduce tran, upsizing/downsizing the cells, removing/adding buffer where it is required by checking the margins of timing paths.
  • Fixed IREM violations by different techniques like cell padding, manually moving the cells, adding buffers onroute, splitting the fanout and manual routing techniques
  • I have learnt and fixed metal & base DRC violations and LVS violations by following Physical verification guidelines.

Project Name : MI300

Technology : 6nm TSMC, 13 metal layers (2RDL layers)

Tools : ICC2, Start RC and Primetime

Macro Count : 36

Instance Count :212k & 448k (Two smu & one io tiles)

Frequency : 2GHz

  • Handled PNR flow from Floorplan to Routing and ECO’s
  • I got to learn about utilization and congestion issues and methods to control them
  • Did manual Latency and Skew balancing to meet up the timing goals.
  • DRV (data trans, data cap, noise, bottle neck, clock SI and double switch) fixes.
  • Fixed critical drcs,shorts manually in ECO phase.
  • Fixed setup and hold critical paths with different techniques in ECO phase

Physical Design Engineer

Mirafra Technologies (Client : INTEL & AMD)
07.2019 - 10.2020

Client : INTEL

Technology : 10nm sdg74, Intel foundry with 14 Metal layers + RDL layer

Tools : ICC2, Start RC and Primetime

Role : Responsible for Block Level P&R Implementation

Instance Count : 1.5 million (1 Sub system)

Frequency : 1.8GHz Responsibilities:

  • Understanding UPF and resolving its related MV violations. Power-mesh was adjusted to meet Static IR drop violations, had to do different floorplan experiments and lot of path groups to meet the timing issues.
  • Block was routing critical and removed NDRs for a few clock nets carefully without impacting timing and clock tree quality metrics.
  • Adding of new DIC cells to fix the timing at SOC level and building of analog nets.
  • Timing fixes for setup by multicycle Paths and in ECO stage fixes done by using clkPULL and clkPUSH

Physical Design Engineer

Aricent Technologies (AMD-ODC)
04.2018 - 04.2019

Client : AMD

Technology : 7nm with 14 Metal layers

Tools : ICC2, Start RC and Primetime

Role : Responsible for Block Level P&R Implementation

Macro Count : 24

Instance Count : 925k, 724k (Two Soc tiles)

Frequency : 1.2 GHz

  • RTL to GDSII implementation like Floorplan, CTS, Route, LVS & DRC. Challenges faced are because of block dimensions, where it is having lot of notches are creating congestion.
  • Followed the N7 floorplan guidelines while placing the macros.
  • Reducing the SOCCLK latency was challenging, resolved this issue by applying bounds.
  • Routing: We had to address routing-DRCs with Route-guides being created. Timing Violations Are cleaned-up using Prime time in interactive mode.
  • Setup and Hold violations in critical paths are analyzed and closed very carefully.
  • Calibre BaseDRC’S & BaseLVS was cleaned at Floorplan stage, it’s the first check point for the N7 floorplan guidelines implemented while placing the macros

Education

INTERMEDIATE - M.P.C

Kakatiya Mahila Junior College
03.2009 - 03.2011

SSC -

Kakatiya High School
03.2008 - 04.2009

B.TECH - Electronics And Communication Engineering (ECE)

Vijay Rural Engineering College
03.2011 - 05.2015

Skills

 63 Years of experience in Physical Design and Responsibilities are taking the blocks from Floorplan to GDSII and perform block-level sign-off checks like Timing analysis, EM and IR Fixing

 Have sound expertise on Floor Planning, Power Planning, IR Drop Analysis, Place and Opt, CTS,Routing, Extraction and Signal Integrity

 Experience in lower technology nodes such as TSMC 6nm, 7nm and able to handle complex designs with multi million gates and tens of macros

 Good at debugging and analyzing critical timing paths before hand and take care of those paths with appropriate implementation techniques

 Have experience in STA, timing Eco's, functional Eco's, metal Eco's implementation

 Have hands on experience in DRC, LVS, DRV fixes, Glitches, Antenna and IR/EM fixes

 Working Knowledge on UNIX

Contact

Hyderabad, INDIA 502319

Personal Information

Education

Nizamabad,Nizamabad,Nizamabad

Disclaimer

I hereby declare that the information given above is correct and true to the best of my knowledge.

Timeline

Member of Technical Staff

Modernize Chip Soutions
09.2024 - Current

Physical Design Engineer - II

Appex Semiconductor (AMD-Client)
07.2023 - 07.2024

Physical Design Engineer

AdeptChips Service Pvt Ltd (AMD-ODC)
10.2020 - 07.2023

Physical Design Engineer

Mirafra Technologies (Client : INTEL & AMD)
07.2019 - 10.2020

Physical Design Engineer

Aricent Technologies (AMD-ODC)
04.2018 - 04.2019

B.TECH - Electronics And Communication Engineering (ECE)

Vijay Rural Engineering College
03.2011 - 05.2015

INTERMEDIATE - M.P.C

Kakatiya Mahila Junior College
03.2009 - 03.2011

SSC -

Kakatiya High School
03.2008 - 04.2009
Niveditha PuskuriPhysical Design Engineer