Detail-oriented PCB Design Engineer with 5 years of hands-on experience in PCB layout design, schematic drafting, footprint & symbol creation. Proficient in multi-layer and high-speed board designs, high-current power cards, split power planes, and fabrication deliverables. Adept at generating all necessary manufacturing outputs, including photo plots, NC drills, and Gerbers.
Project Highlights
Tools Used: Cadence Allegro | Team Size: 3
Specs:
- 150 mm x 100 mm
- 8 Layers
- 1250 Components
- 2386 Connections
- 18 Split Planes
Key Contributions:
- Footprint and stack-up creation
- Power supply routing & plane splitting
- DRC checks and Gerber generation
- Packaging for fabrication & NPI clarification.
Tools Used: Altium 20.1, ViewMate 11.18 | Team Size: 2
Specs:
- 8-layer stack-up, 1.6mm thick
- 1592 pin connections
- FBGA, DDR2, NAND Flash
- Blind/Buried Vias
- JTAG/I2C/SPI/UART Interfaces
Key Contributions:
- Symbol/footprint creation
- Routing analysis
- Customer reviews and Gerber generation
Tools Used: Altium 20.1, CAM350 | Team Size: 2
Specs:
- 8-layer stack-up, 1.6mm thick
- 5GHz operation
- FBGA-256, DDR2, NAND/NOR, eMMC
- PCIE M.2, USB, RJ-45
- SPDT switch & Bluetooth section
Key Contributions:
- Symbol/footprint design
- Placement & routing
- Signal integrity checks and Gerber release