Prakash Kurma Raju

Product design and tooling engineer

CIPET, Intel Corporation

Mysore

01.2000 - 01.2005

Driving thermal performance, Customer scaling, New material, and Ecosystem development:
Solved skin temperature limitations in a 12W passive device by designing a patented cross spreading hinge which enables transfer of heat to lid surface through natural convection thereby improved performance by 30% (9W to 12W)
Patented and developed offset convertible hinge to mitigate the challenge of maintaining lower gap b/n lid & base in convertibles with larger foot height, which resulted in reduction of system Z by 0.5mm while increasing airflow by 20%
Patented and developed laptop hinges for new formfactors and implemented in breakthrough 17” foldable products which helped Lenovo to launch X-1 fold and ASUS ZenBook Pro Duo
Defined unique manufacturing process in collaboration with ecosystem to manufacture 0.55mm thin unibody aluminium chassis with improved mass production yield (60% to 92%) at lower cost ($76 to $55) which has helped to customers launch thinnest 5.9mm detachable / tablet products
(Dell Venue-8)
Developed seamless chassis design to enable patented 5G barricade antenna in convertibles and LTE slot antenna in a foldables with premium look without compromise on antenna performance
(Lenovo 770, S970 and MSI 17MX, MSI16VX)
Patented and developed high conductive reliable frilled graphite (passing lifecycle of 200000 open close) spreader, which was critical to enable 9W SoC in FOLDABLE devices
Championing high performance fans roadmap with 10% gen-over-gen improvement to deliver Cool, Quiet & Performant (CQP) targets in Intel EVO designs
Samsung Galaxy Book S design win back and Co-engineered with Samsung in solving Co-PoP SoC thermal challenges by implementing dual sided thermal solution in a constrained envelope
Enabled 1st foldable computing device (Lenovo ThinkPad X1 Fold) - Implemented thin chassis material and guided on the foldable hinge solution
To achieve Dell’s industrial design & antenna performance, implemented NMT (Nano molding technology) & resolved all the manufacturing challenges to launch thinnest Iconic tablet Dell Venue 8
Co engineered in developing and scaled patented flow architecture to increase thermal performance by 20-25%
Customer implementing Alder Lake, Raptor Lake, and Meteor Lake EVO designs (Lenovo S970, Zeus2, HP Woodford) and RPL (ASUS UX6402 and Lenovo S 770-16)
Vapor Chamber (VC) solutions are key for enabling high performance in thin form factors however adoption was limited due to high cost
Introduced patented wick structure with simplified manufacturing process to reduce VC cost by 40% (Lenovo, ASUS UX6402, HP and MSI implemented this solution)
Actively co-engineering with start-ups & vendors to get futuristic technologies (Electro plated wick for 2X perf, Hybrid cross-spreading, Composite thin chassis, Solderless shields, and Clean D chassis – All are patented) to scale innovative solutions to compete in the industry
To enable ESG developed sustainable chassis material, patented, and developed manufacturing methods to anodize recycled magnesium alloy by introducing Al -1XXX to magnesium alloy chassis surface
Patent committee member for client computing group (CCG) from past 6 years
Passionately mentoring upcoming technical talent and coaching Thermal Mechanical team resulting in mentees filing 56 patents in 4 years in thermal mechanical system domain
Mentored team to focus on solving customer pain points that translated into scaling 10 technologies through ecosystem partners who are delivering Intel exclusive technologies for Intel EVO devices
Role modeled as change agent in driving frugal innovation beyond CCG by collaborating with other Intel BU’s and reduce thermal solution cost by $3/unit
Working with Universities for growing promising engineers by engaging varied research works in India and mentoring 4 students from Arizona State University - USA on materials and system mechanical innovations.

Similar Profiles

Kimberly Calderon PradoKimberly Calderon Prado

System Software Engineer - Embedded Systems at Intel Corporation - Intel FlexSystem Software Engineer - Embedded Systems at Intel Corporation - Intel Flex

Madhan A KMadhan A K

Product Security Expert / Security Researcher at Intel CorporationProduct Security Expert / Security Researcher at Intel Corporation

Jabeen AbbasiJabeen Abbasi

Module Development Engineer, LTD Lithography at Intel CorporationModule Development Engineer, LTD Lithography at Intel Corporation

Chiadikaobi NjokuChiadikaobi Njoku

Mfg Systems Software Development Engineer at Intel CorporationMfg Systems Software Development Engineer at Intel Corporation

BHUVANA PALANISAMYBHUVANA PALANISAMY

Principal Engineer at Collins AerospacePrincipal Engineer at Collins Aerospace

Summary

Work History

Principal Engineer

Sr. Thermal mechanical System Architect

Sr. Thermal mechanical Technologist

Sr. Mechanical Technical Leader & Tooling specialist

Sr. Mechanical System Architect

Sr Technical Leader, manufacturing specialist

Mechanical Engineering Specialist

Product design and tooling engineer

Education

Post Graduate Diploma - Plastics Product, Tool designing and Manufacturing

Bachelor of Mechanical Engineering - undefined

Skills

Work Availability

Quote

Timeline

Principal Engineer

Sr. Thermal mechanical System Architect

Sr. Thermal mechanical Technologist

Sr. Mechanical Technical Leader & Tooling specialist

Sr. Mechanical System Architect

Sr Technical Leader, manufacturing specialist

Mechanical Engineering Specialist

Product design and tooling engineer

Post Graduate Diploma - Plastics Product, Tool designing and Manufacturing

Bachelor of Mechanical Engineering - undefined

Overview

Similar Profiles

Kimberly Calderon PradoKimberly Calderon Prado

Madhan A KMadhan A K

Jabeen AbbasiJabeen Abbasi

Chiadikaobi NjokuChiadikaobi Njoku

BHUVANA PALANISAMYBHUVANA PALANISAMY