Pratibha Pakirla

• Creating and maintaining component symbol and foot print under global standards
• Designing of PCBs under EMC/EMI complains, cross talk and Signal Integrity
• High speed routing of differential busses, clock signals, SRIO signals, RIO signals, data bus and other Impedance controlled signals
• Bill of Material creation, Assembly files and Gerber creation and verification
• Maintained design files revisions throughout design process
• Achievements:
• Designed Power Supply Boards for ISRO
• Introduced Strong Process between PCB Design-Mechanical Team
• Improved Communication with supplier and factory to strengthen relationship with R&D
• Prepared and standardized checklist for PCB design, reviewing and releasing process with help of hardware team
• Projects:
• Power supply modules, SMPS, Inverter PCBs
• Defense, Space & other commercial PCBs

• Accountabilities:
• Used CADSTAR and ORCAD to design schematics and also conversion of schematics to PCB layout including component symbols and foot prints
• Laid out high power boards for HIGH POWER INVERTERS up to 10KVA
• Laid out high frequency power boards for LED DRIVERS, SOLAR CHARGE CONTROLLERS and MPPT CHARGERS
• Laid out of SMPS Isolated and Non Isolated for AC to DC and DC to DC converters
• Experience in HIGH POWER/VOLTAGE, HIGH FREQUENCY placement and routing.
• Create CAM documents and Gerber files that enabled fabrication and assembly vendors to produce PC Board in high volume
• Designing of solar home lighting systems, solar fans, solar street lights
• Battery protection circuits like LVD, over charge protection, short circuit protection
• Design, Developed and Laid out PIR MOTION sensor based projects that are SOLAR REST ROOM BULBS for AMERICAN NGO’s
• Design, Developed and Laid out EMERGENCY LIGHT which is available in the market and also available in the E-SEVA & MEE SEVA centers
• Preparation of documentation and specifications for required test setups & procedures
• Designing experience on small circuits like comparators and op-amp circuits.

• Used CADSATR to design BGA components for complex, multilayer PCB layouts, including analog, digital high speed and high frequency signals
• Import schematics from different boards and synchronized/merged them into one board design
• Export board designs (.DXF files) for using mechanical layouts
• Interface with HAL, ECIL, BDL, BEL, Defense engineers to produce and variety of aerospace and ground support systems
• Designed multi layered microprocessor boards for SDR (software define radio) for AEROSPACE applications
• Generation of library management
• Understood of layout techniques for high density
• Laid out VHF/UHF communication modules sets used for airborne military purpose
• Preparation of bill of materials and required documents for complete project .

GPA: 68.2

GPA: 85.1

GPA: 83.3