RAHUL CHAUBE

Managed FATP process activities including assembly, testing, packing, and line setup for new products.

Performed root cause analysis and implemented CAPA to resolve production and quality issues.

Optimized process parameters to improve FPY, reduce defects, and enhance production efficiency.

Coordinated with cross-functional teams for troubleshooting and continuous process improvement.

Handled machine setup, product changeovers, and process validation activities.

Ensured compliance with quality standards, SOPs, ESD, and IMS requirements.

coordinate SMT/PCBA assembly processes and line operations

streamline stencil printing, SPI, AOI, reflow, and placement operations

evaluate production criteria and improve operational efficiency

overcome machine and process obstacles

eliminate defects through root cause assessment and corrective strategies

optimize NPI process validation and engineering adjustments

ensure process documentation practices and production reports

work alongside production quality assurance and maintenance units

uphold ESD 5S standards and safety protocols on shop floor

optimize yield, cycle time and overall productivity

Coordinated complete SMT production processes including stencil printing, SPI, pick & place, reflow oven, and AOI optimization.

Monitored line productivity, machine performance, and process yield improvement activities.

Performed root cause analysis for SMT defects such as solder bridging, tombstoning, missing components, polarity errors, and solder voids.

Developed and updated SOPs, process parameters, and troubleshooting guidelines for stable production performance.

Supported NPI builds, process validation, and mass production stabilization while ensuring IPC standards, ESD control, and 5S compliance.

Improved first pass yield, reduced rejection rates, and minimized downtime through effective CAPA and process improvement initiatives.