Summary
Overview
Work History
Education
Skills
PROJECT HIGHLIGHTS
Timeline
Generic

Raviram Jayaraman

R&D Staff Engineer
Bengaluru

Summary

Accomplished Physical Design Engineer with 10+ years of experience in executing complex RTL2GDSII flows and achieving full sign-off closure across multiple advanced process nodes and low power MPP designs. Skilled in scripting with Shell, TCL and Python for flow automation and efficiency improvements. Demonstrated ability to lead design efforts in high-performance SoCs, with a consistent record of successful tape-outs and cross-functional collaboration.

Overview

11
11
years of professional experience

Work History

R&D Staff Engineer

Synopsys India Pvt Ltd.,
09.2023 - Current
  • Lead the latest PCIe IP design implementation (a team of four engineers), own top design, perform design planning, analyze design implementation issues, provide constructive design and constraint feedbacks to stakeholders.
  • Improvise and develop FPM flow by identifying key areas of improvement, integrate latest technology packages (TCM, DRC, LVS, STARRC, Prime Closure, Primetime and PTPX) into flow.
  • Develop methodologies to improve and enhance PPA metrics across different IP ecosystems. Were able to achieve ~5-10% improvement in leakage power without much degradation to timing.

Senior Structural Design Engineer

Intel India Pvt Ltd.,
12.2021 - 09.2023
  • Responsible for design implementation from RTL2GDSII and Sign-Off closure.
  • Collaborate with cross functional Sign-Off teams to generate timing, IR and PV ECOs, automate the analysis and ECO generation process to reduce ECO execution cycles.
  • Developed strategies / methodologies to build custom clock structures to achieve stringent skew and latency targets for 1-2GHz clocks.
  • Meticulously plan VA, PG region strategies, verify low power integrity of UPF constraints for MPP designs.

Senior Physical Design Engineer

Capgemini India Pvt Ltd.,
04.2017 - 12.2021
  • Successfully achieved six tap-outs, across multiple clients.
  • Responsible for RTL2GDSII and Sing-Off closure of multiple critical blocks.
  • Automate and develop design execution methods to improve design closure time.
  • Mentored junior engineers in industry best practices, fostering a positive learning environment within the team.

Physical Design Engineer

Mirafra Technologies Pvt Ltd.,
03.2016 - 04.2017
  • RDL and analog routing of IPs. Validate and review with multiple IP owners.
  • Perform B2B (bump to bump), C2B (clamp to bump) verification to ensure the robustness of power distribution network.

Physical Design Engineer

Wipro India Pvt Ltd.,
10.2014 - 03.2016
  • Responsible for RTL2GDSII design implementation of analog mixed signal design.
  • Perform various sign-off validations and achieve optimal design and sign-off targets.

Education

Bachelor of Engineering - Electrical And Communication Engineering

Panimalar Engineering College (Anna University)
Chennai, India
04.2001 -

Skills

    DESIGN TOOLS: ICC2, Innovus, Fusion Compile, Design Compiler

    VERIFICATION TOOLS: TCM, VCLP, StarRc, Primetime, PrimeClosure, Conformal, Caliber, Redhawk

PROJECT HIGHLIGHTS

3nm - PCIe7 (~15M)

  • Lead PCIe7 top and block RTL2GDSII implementation and Sign-Off to closure using FPM flow and achieve improved PPA.
  • Perform design planning, provide floorplan instruction to partition owners, provide design and constraint feedbacks to design team.
  • Provide technical guidance / assistance to team members, create methodologies and scripts to enhance execution and analysis quality.
  • Create standardized flow and methodologies which can be used by customers of PCIe7 and to help them achieve best PPA metrics.


3nm - UCIE (~8M) ; PCIe6 (~8M)

  • Provide PPA improvement techniques to implementation team, guide them with execution methods and implementation guidance to help them achieve their PPA targets.
  • Develop cutting edge FPM flow methodologies for implementation and Sign-Off and deliver to customer.


3nm - ARM core (Target FMAX: 3.4GHz)

  • Provide technical assistance to balance the skew between top and block. Help create CTS strategies to achieve latency and skew targets.
  • Scripts to identify critical paths, generate ECOs to fix timing and achieve FMAX targets.


5nm - PCIe5

  • Develop TCM Constraint verification, promotion, demotion and equivalence flow. Validate the flow, work with R&D team to develop / enhance the flow.


3nm - PCIe6

  • Using PCIe6 design as base develop technology packages for TCM, DRC, LVS, PRIMETIME, PRIME CLOSURE, STARRC, VCLP and RV checks.
  • Develop the flow, implement the flows, test and validate and deploy to customer. Provide support to customers.
  • Port the RM flow created into FPM wrapper and perform regression test.


10nm - Server GPU (~1.2M)

  • Critical timing interface paths closure using custom methodologies, clock pre-route planning, custom clock building, register level planning without performance degradation.
  • Dynamic interface constraint creation helped to reduce interface timing closure turn around time.
  • Clock feed-throughs were planned efficiently to take care of clock insertion across all the block in design.


10nm - Server GPU (~1.7M)

  • Multi die interface partition with 2GHz main clock. Special clock strategies to achieve clock skew targets as less as 50ps.
  • Placement of macros, especially the placement of PPLs and custom routing of clock routes were planned meticulously to achieve optimal results.
  • Clocks exit ports to other blocks were pre-routed with NDRs and custom routes to matches latency across multiple clock exit points.
  • Special techniques like MPCTS / MSCTS and CTMESH were achieved by using in-house clock builder methodologies.
  • Efficient planning of voltage areas and pg regions to reduce congestion and to better handle cross clock paths. VCLP checks were performed and design feedbacks were provided promptly to reduce turn around time.


28nm - Qualcomm (Ferrolite_cate6, Stingray and NapaliQ)

  • RDL and analog routing of IPs and bumps. Review and validate the routing with the IP owner.
  • Perform bump to bump, clamp to bump and clamp to clamp resistance verification and performed fixes based on the reports to achieve robust RDL routing network.

Timeline

R&D Staff Engineer

Synopsys India Pvt Ltd.,
09.2023 - Current

Senior Structural Design Engineer

Intel India Pvt Ltd.,
12.2021 - 09.2023

Senior Physical Design Engineer

Capgemini India Pvt Ltd.,
04.2017 - 12.2021

Physical Design Engineer

Mirafra Technologies Pvt Ltd.,
03.2016 - 04.2017

Physical Design Engineer

Wipro India Pvt Ltd.,
10.2014 - 03.2016

Bachelor of Engineering - Electrical And Communication Engineering

Panimalar Engineering College (Anna University)
04.2001 -
Raviram JayaramanR&D Staff Engineer