Accomplished Physical Design Engineer with 10+ years of experience in executing complex RTL2GDSII flows and achieving full sign-off closure across multiple advanced process nodes and low power MPP designs. Skilled in scripting with Shell, TCL and Python for flow automation and efficiency improvements. Demonstrated ability to lead design efforts in high-performance SoCs, with a consistent record of successful tape-outs and cross-functional collaboration.
DESIGN TOOLS: ICC2, Innovus, Fusion Compile, Design Compiler
VERIFICATION TOOLS: TCM, VCLP, StarRc, Primetime, PrimeClosure, Conformal, Caliber, Redhawk
3nm - PCIe7 (~15M)
3nm - UCIE (~8M) ; PCIe6 (~8M)
3nm - ARM core (Target FMAX: 3.4GHz)
5nm - PCIe5
3nm - PCIe6
10nm - Server GPU (~1.2M)
10nm - Server GPU (~1.7M)
28nm - Qualcomm (Ferrolite_cate6, Stingray and NapaliQ)