NAND PRODUCT ENGINEERING INTERN
Validated NAND components for different designs during my internship in the NAND Product Engineering team.
Tasks Accomplished :
1. Conducted speed parametric analysis of ODS, ODT, TDVW, and TDIVW parameters on different NAND components . Accomplished key tasks such as NBTI analysis and DSV removal through which I have gained valuable experience in JMP software and enhanced my understanding in data analysis and debugging.
2. Analyzed the bench-to-volume correlation of Output Drive Strength for NAND through which I got good exposure and understanding in Magnum testers and trimshmoo . Automated Testing of NAND components using perl in CLI gave me a good command in scripting.
3. Contributed to Sim2Si analysis for NAND output driver . Working on this helped me to develop a good understanding of HSPICE simulation
and Cadence by collaborating with design team.
4. Followed up on Trim by Die alignment for NAND. Collaborated with global teams on ATE and AQLK issues .