Rekha Thangavelu

Experienced, collaborative technical project manager with a strong background in LTE ORAN CU/DU, embedded systems, and the telecom domain.

Self-motivated and efficient leader, adept at coordinating multi-disciplinary teams across various time zones.

Demonstrates excellent multitasking skills and thrives under pressure. Skilled in prioritizing tasks and optimizing workflows, consistently meeting deadlines. Known for effective client collaboration leading to successful outcomes.

• Team Excellence Award for Accountability.
• Team Excellence Award for Quality Delivery- Resolving critical Customer issues.
• Team Excellence Award for Collaboration- Platform support for Rel 10 CA feature
• Kudos Award for Quality Delivery- migration of eNodeB stack to multiple TI platform software
• Snap award for achieving key performance throughput targets for LTE stack on TI Processor platform

____________________________________ 2025

LTE CRAN CU

Description: LTE CU  feature development and customer support in CRAN .

Role: Senior Manager R&D

Team Size: 15+

Responsibilities:

• People and project management.
• Scrum master
• Drive the feature development and multiple customer support activities (Airtel/BellCanada/Paradise/TurkCell/Vilicom/VDF UK/DTAG) for the CU team
• Feature owner for CU features like Dynamic PRB allocation, DL and UL carrier aggregation, CU KPI enhancements, V1 interface optimization, ANR detection of 5g Cells, PRB blanking, Priority based Inter Frequency HO, CATM implementation
• Coordinate across multiple teams like Dev, System Engineering, DU, System test , Customer Engagement & Program Management .
• 3gpp spec understanding and protocol working knowledge- RRC, S1AP, X2, PDCP
• Involved in all phases of Requirement gathering, design , code review and dev test.
• Troubleshooting and triaging of CU issues from customer
• Provide technical , architecture and design implementations for coding in C.
• Drive sprint Planning, DSM ,Story point estimation,Risk identification and mitigation, Dependency resolution Retrospective ,Backlog Refinement,sprint burn down tracking

____________________________________ 2020

LTE CRAN Femto Cell DU

Description: Re-architect the LTE protocol stack for Femto DU in CRAN . Develop Test framework for UT and SSI in test driven approach.

Role: Associate Manager

Team Size: 4

Responsibilities:

• Team building and team management.
• Velocity and capacity assessment of team. Resource planning and work allocation.
• Assess the team and provide technical and non technical feedback .
• Drive sprint Planning,DSM ,Story point estimation,Risk identification and mitigation, Dependency resolution Retrospective ,Backlog Refinement,sprint burn down tracking
• Provide technical , architecture and design implementations for coding in C.

_______________________________________2019

LTE Stack porting on Qualcomm (QC9016) chipset:

Description: Porting of LTE stack on the Qualcomm processor.

Role: Technical Lead

• Lead the activities for the Network Listen module porting.

____________________________________2018-2019

GSM Stack Porting on CEVA processor:

Description: Porting of the GSM stack from Texas instrument to CEVA multicore processor

Role: Technical Lead

• Involved in development activities for FreeRTOS porting,GMSK modulator,Timing and Memory optimization,Interrupt handling and task designing

____________________________________2016-2018

LTE- XFT team for Cobham wireless:

Description: Cross functional team implementing new LTE features and resolving bugs on the TM500 CUE product line. Features implemented: eDRX, Band41 high power support, NS_05 AMPR on eMTC CATM

Role: Senior Technical Lead/SAFe Agile scrum master

____________________________________2011-2016

enodeB SW porting on Texas Instrument processor (LTE):

Description: Porting of LTE L2 stack onto different TI processor(DSP C6614, C6638, TI K2H, K2L)

Role: Senior Technical Lead

Team Size: 20

Responsibilities:

• Lead the platform team activities for the porting on TI platform.
• Performance and optimization on TI DSP processors
• Development activities: Ethernet and PA interface implementation with multi-tasks model using TI msgcom module,TI UIA based instrumentation framework, End-to-End Debugging and Testing of Protocol stack for throughput and L2/L1 issues on IXIA, Aeroflex, Data Card setups.