ViewMate – Gerber file viewing and analysis
Sayok Ghosh
PROCESS & EQUIPMENT ENGINEER
Bangalore
Summary
Dedicated PCBA Process Engineer with 2.5 years of experience in high-mix, low-volume manufacturing. Skilled in SMT, wave soldering, conformal coating, and rework. Proven ability to support NPI, improve quality, and resolve line issues while working with cross-functional and diverse teams.
Overview
2
2
years of professional experience
5
5
years of post-secondary education
3
3
Languages
Work History
Equipment & Process Engineer
R Logic Technology Services Pvt Ltd
06.2025 - Current
- Performing validation and creating programs for NPI (New Product Introduction) models on Solder Paste Printing machines, SPI (Solder Paste Inspection), and Reflow ovens.
- Validating and optimizing Reflow profiles to ensure thermal process compliance and solder joint quality.
- Creating and validating wave soldering process parameters based on board design and component types.
- Troubleshooting and resolving daily line issues related to SMT, wave soldering, and reflow processes.
- Supporting and coordinating with the NPI team during pilot builds and first-time production runs.
- Performing inspection setup and assisting with AOI (Automated Optical Inspection) validation and troubleshooting.
- Overseeing conformal coating processes, ensuring correct masking, coating thickness, and curing conditions.
- Providing technical support, process training, and guidance to operators and production associates.
- Continuously monitoring process stability, identifying improvement opportunities, and implementing corrective actions to maintain yield and quality.
Process Engineer
Schneider IT Business India Pvt Ltd, Jigani
03.2023 - 05.2025
- Responsible for creating programs and troubleshooting process defects in solder paste printing, reflow, wave soldering, selective soldering, conformal coating, SPI, post-wave AOI, and CC inspection.
- Responsible for taking profiles and validating wave soldering and reflow soldering processes during every changeover.
- Selecting the solder paste and soldering flux required for the PCBA process.
- Identifying and capturing all CTPs (Critical to Process) and CTQs (Critical to Quality) to ensure defect-free products.
- Identifying quality-related improvements and defects during and after assembly.
- Creating DFM (Design for Manufacturability) inputs before and after pilot PCBA production.
- Performing inspection, validation, and qualification of PCBA, including component and solderability quality during NPD.
- Monitoring KPIs of the production process such as SPI FPYR, Post AOI FPYR, Post Wave FPYR, ICT FPYR, and machine downtimes.
Education
Diploma - Electrical Engineering
Swami Vivekananda School of Diploma
01.2019 - 01.2022
Higher Secondary Education - undefined
Nakraconda High School
01.2017 - 01.2019
Skills
SMT, Wave Soldering, and Conformal Coating Processes
Reflow Profiling and Thermal Paste Dispensing
Solder Paste Inspection and AOI Operation
PCB Rework and Basic Troubleshooting
Gerber File Viewing and Analysis
New Product Introduction (NPI) Support
Process Validation and Line Issue Handling
Report Preparation and MS Office Tools
Team Collaboration and Communication Skills
Software
Mole MAP3, SuperMOLE® Gold – Thermal profiling and data analysis
KIC Software – Reflow oven profiling and optimization
MS Office (Word, Excel, PowerPoint) – Documentation, data handling, and SPC reporting
SPC Tools – Process monitoring and control
Interests
Watching Movies
Cricket
Declaration
I hereby declare that the above-mentioned information is true and correct to the best of my knowledge and belief.
Timeline
Equipment & Process Engineer
R Logic Technology Services Pvt Ltd
06.2025 - Current
Process Engineer
Schneider IT Business India Pvt Ltd, Jigani
03.2023 - 05.2025
Diploma - Electrical Engineering
Swami Vivekananda School of Diploma
01.2019 - 01.2022
Higher Secondary Education - undefined
Nakraconda High School
01.2017 - 01.2019
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