Summary
Overview
Work History
Education
Skills
Accomplishments
Additional Information
Certification
Timeline
Generic

Shaheen Sulthana

Summary

6+ years of Experience in Custom/Analog/RF/SERDES Layout Design. Specialized in the design and implementation of analog integrated circuits, focusing on the physical layout components and deep understanding of semiconductor physics, circuit design principles, and layout techniques to ensure optimal performance and manufacturability. Experience in layout designs for 180nm down to 2 nm process nodes.

Professional Experience:

  • Expertize in efficient floor planning, area optimization, parasitic minimization and thorough understanding of design rules, device matching, sharing, various design challenges, including ESD issues, BUMP placement, IP integration.
  • Expertize in debugging DRC, LVS, ANT, Density, EMIR.
  • Hands-on experience on Latch up, Antenna Effect, Density, ESD, deep sub-micron effects and LLE in macro top and sub-blocks. Worked on Deep N-well Concept.
  • Involved in development of high speed SerDes IPs with data-rate up to 48Gbps, including MPHYG5/G6, PCie, HPC, Ethernet, Vby1TX, RF IPs. Hands on experience on TX,RX,PLL modules.
  • Built LC-VCO which was a first-pass silicon success.
  • Hands -on experience on tape out process (LDFW/LEF/Cross fire).
  • Collaborating with circuit designers to debug issues and ensure timely resolution. Responsible for debugging failures to the root cause ,Address issues related to parasitic capacitance and inductance to enhance circuit performance and full chip-level integration support.
  • Worked with Customers to understand their flow requirements and map them to features within Custom Layout design Platform.
  • Developed and maintained detailed documentation for layout processes, including design rules, methodologies, and best practices to streamline future projects.
  • Participated in design reviews and provided critical feedback on layout strategies, contributing to the overall improvement of design quality and efficiency.
  • Demonstrates strong analytical, communication, and teamwork skills, with proven ability to quickly adapt to new environments and results-oriented mindset. Eager to contribute to team success and further develop professional skills. Brings positive attitude and commitment to continuous learning and growth.
  • Proven ability to handle multiple tasks effectively and efficiently in fast-paced environments. Recognized for taking proactive approach to identifying and addressing issues, with focus on optimizing processes and supporting team objectives.

Leadership:

  • Managed layout team of 8 people
  • Built a new 4 member TECH COMMITTEE @SAMSUNG.
  • Co-lead/Team member- QA Layout
  • Hiring, Mentorship and training for Layout.
  • Active participation in Internal and External paper and tutorial/poster.
  • Attended Conference(Cadence/SNUG/SIEMENS/IEEE)

Circuit Simulation:

  • Inductor/TCOIL design and EMX simulation
  • PEX generation

Overview

6
6
years of professional experience
1
1
Certification

Work History

Staff Engineer

Samsung Semiconductor India R and D
01.2023 - Current
  • Compact floor planning, area optimization, parasitic minimization , device matching, sharing, various design challenges, including ESD issues, BUMP placement, IP integration.
  • Performed layout verification LVS ,DRC, Antenna, Density, Latch-up, quality check, and documentation, responsible for on-time delivery of block-level and IP layouts with acceptable quality.
  • Designed TCOIL and INDUCTORS for the IP with Quality
  • Participated in yield enhancement initiatives by analyzing layout patterns and making recommendations for design modifications to improve manufacturability.
  • Demonstrated leadership Skills in project execution, area, time estimation, scheduling, delegation, and execution to meet project schedules milestones.
  • Hands on experience .spf file generation ,TCOIL,TOTEM simulations.
  • Guided junior team members in their execution of Sub block-level layouts review their work.


Senior Engineer

Qualcomm Technologies, Inc.
08.2022 - 01.2023
  • Developed LNA ,PA sub-blocks, Layout from Schematic, Floor Planning, Power planning and Routing.
  • Fixed Antenna Violations.
  • Matched coupling on Differential RF signals.
  • Fixed Latch-up and poly density in synthesizer. Automated Flow, Conducted extensive DRC and LVS checks to validate layout integrity, identifying and resolving potential issues before fabrication to minimize errors of chip.
  • Delivered 2 successful test chip in short duration

Engineer

Moschip Technologies
05.2019 - 07.2022
  • Experience in different Layout approaches associated with SERDES/Analog sub-blocks from floorplan to closure with knowledge of basic circuits, matching constraints, and design-driven constraints expected.
  • Responsible for timely and quality execution of Custom Layout design.
  • Effectively communicated with Design Engineers to clarify and realize the layout requirements based on the schematic functions

Education

Bachelor of Technology - Electronics And Communications Engineering

PullaReddy Institute of Technology
Wargal, Telangana, India
05-2016

Skills

  • Layout Design
  • Verification checks
  • Quality Assurance
  • Project Management
  • Technical Paper Writing
  • Leadership
  • Cross-team collaboration
  • Organization and time management

Accomplishments

    My biggest achievement includes successfully designing and delivering a high-speed SERDES interface for a high-performance networking chip and LCVCO, which resulted in a significant increase in data transmission rate . My attention to detail and strong problem-solving skills have been instrumental in ensuring the manufacturability and reliability of my designs to reduce TAT which lead to project success.

    SPOT AWARD: Samsung semiconductor India R and D, Jan 2025:

    Extra mile: Layout design optimization to meet the quality and smooth delivery MPHY TX IP

    Recognition: ThankQ: Qualcomm Technologies ,Sep 2023

    On time delivery with high quality RFFE next generation monolithic FEM test chip

Additional Information

Hands-on Experience on High-Speed Blocks:

MPHYG5/G6, PCieGen-3, Vby1TX,HSSTP IPs

⦁TX: Serialiser, Driver, CD and TCOIL

⦁PLL: VCO, INDUCTOR, PFD, CP and LPF

⦁RX: PI, CDR, CTLE

⦁RF : LNA,PA blocks

⦁Bandgap/LDO

Certification

IBIS-AMI generation Through System Vue- KEYSIGHT TECHNOLOGIES -Jan 2025


Cadence Layout Technology -Cadence Virtuoso -Apr 2023


Timeline

Staff Engineer

Samsung Semiconductor India R and D
01.2023 - Current

Senior Engineer

Qualcomm Technologies, Inc.
08.2022 - 01.2023

Engineer

Moschip Technologies
05.2019 - 07.2022

Bachelor of Technology - Electronics And Communications Engineering

PullaReddy Institute of Technology
Shaheen Sulthana