Summary
Overview
Work History
Education
Skills
Protocol
Tools & Instruments
Languages
Websites
Certification
Accomplishments
Timeline
Generic

Sibani Bebarta

Bengaluru

Summary

Dynamic and results-driven Senior Hardware Engineer with 6+ years of hands-on experience in high-speed circuit design, schematic development, signal and power integrity analysis, hardware validation, and system-level debugging. Proven track record of taking complex board-level hardware from concept to production with precision and performance in mind. Adept at using advanced simulation tools, lab instrumentation, and cross-functional collaboration to deliver reliable, scalable hardware solutions across automotive, consumer electronics, and embedded systems domains.Now seeking to channel a strong foundation in hardware engineering into cutting-edge driver hardware design,bringing not just technical proficiency, but a relentless drive to learn, innovate, and contribute to the next generation of intelligent hardware interfaces. Equally comfortable diving into low-level driver interactions, hardware-software co-design, and performance tuning to ensure seamless integration between silicon and system.

Overview

6
6
years of professional experience
1
1
Certification

Work History

Senior Hardware Design Engineer

Bosch Global Software technologies
Bangalore
03.2023 - Current

1.Polestar-Infotainment System

Designed Polestar-Infotainment Platform based on Qualcomm SA8295P and Infineon TC387.

Integrated high-speed interfaces, including USB3.1, PCIe, RGMII, and GMSL2 serializers.

Roles & Responsibilities

  • Analyzed and prepared Requirement analysis documents
  • Performed power and clock analysis alongside circuit simulation and analysis.
  • Developed system block diagram creation and interface validation for various vehicle models.
  • Performed Circuit simulations
  • Conducted input analysis and prepared design documentation for HDD, SDD, ATP requirements
  • Completed Circuit design
  • Reviewed PCB design until Gerber release, ensuring compliance with specifications
  • Prepared Input for thermal integrity, Power Integrity and Signal Integrity
  • Performed thermal integrity, Power Integrity and Signal Integrity Simulation
  • Conducted functional testing, chamber testing, and provided assistance to software team during bring-up.
  • Performed indetailed validation.

2.MPCI Rack

MPCI is a rack-based automotive system built around the NXP S32G399 SoC, incorporating LLCE support for CAN, FlexCAN, LIN, and JTAG interfaces to enable advanced in-vehicle networking and gateway capabilities.

Roles & Responsibilities

·Analyzed and prepared Requirement analysis documents

  • Performed power and clock analysis alongside circuit simulation and analysis.
  • Developed system block diagram creation and interface validation for various vehicle models.
  • Performed Circuit simulations
  • Conducted input analysis and prepared design documentation for HDD, SDD, ATP requirements
  • Completed Circuit design
  • Reviewed PCB design until Gerber release, ensuring compliance with specifications
  • Prepared Input for thermal integrity, Power Integrity and Signal Integrity
  • Performed thermal integrity, Power Integrity and Signal Integrity Simulation
  • Conducted functional testing, chamber testing, and provided assistance to software team during bring-up.
  • Performed Indetailed Validation

Senior Hardware Engineer

Larsen & Turbo
Bangalore
03.2022 - 02.2023

Joystick Card

This board is designed with STM micro controller, Input voltage to this board 28V and it is operated for azimuth and elevation angle by using ADC

Roles & Responsibilities

  • Analyzed and prepared Requirement analysis documents
  • Performed power and clock analysis alongside circuit simulation and analysis.
  • Developed system block diagram creation and interface validation for various vehicle models.
  • Performed Circuit simulations
  • Conducted input analysis and prepared design documentation for HDD, SDD, ATP requirements
  • Completed Circuit design
  • Reviewed PCB design until Gerber release, ensuring compliance with specifications
  • Prepared input for thermal integrity, power integrity, and signal integrity.
  • Performed thermal integrity, Power Integrity and Signal Integrity Simulation
  • Conducted functional testing, chamber testing and provided assistance to software team during bring-up.
  • Performed In detailed Validation

6U-VME SBC Card

This Board is a carrier board which can be tested by Picozed SOM. This Board is a general purpose VME64x board with DIP, DOP, RS422 TX/RX,CN Fiber optic TX/RX and VME black plane interface. This board also contains 1Gbps Ethernet Interface, DDR3, FMC, Differential Clock Input (155MHz). . The VME-FPGA is a 6U standard VME card that fits in a double standard euro VME rack. The Ethernet interface is used for host controlling and accessing purpose, which is connected to front panel. The entire board operates with single +5V power supply, powered over VME backplane interface.

Size of Board : 233.33mmx 160mm

No. of layers: 10

Roles & Responsibilities

  • · Analyzed and prepared Requirement analysis documents
  • Performed power and clock analysis alongside circuit simulation and analysis.
  • Developed system block diagram creation and interface validation for various vehicle models.
  • Performed Circuit simulations
  • Conducted input analysis and prepared design documentation for HDD, SDD, ATP requirements
  • Completed Circuit design
  • Reviewed PCB design until Gerber release, ensuring compliance with specifications
  • Prepared Input for thermal integrity, Power Integrity and Signal Integrity
  • Conducted functional testing, chamber testing, and provided assistance to software team during bring-up.
  • Performed Indetailed Validation

Junior Electronics Engineer

Centum Electronics Pvt. Ltd.
Bangalore
08.2021 - 03.2022

MPSoC-SoM and Carrier Board-Chandrayan3

SoM(System on Module)

This SoM is designed with Zynq Ultrascale + MPSoC from Xilinx (XCZU5CG).This SOM is having very high speed interfaces like LPDDR4, DDR4, eMMC,SD Card, USB2.0, QSPI, GBE, Gigabit Transceiver interface which can be used as PCIe-Gen2, SATA and Display Port in a small form factor. The Board is having 3 Nos of high speed connector to interface with Carrier card. The SoM can be used for controlling and processing of radar signals. The Board is designed in such a way that MPSoC can be migrated from 5CG to 2CG/3CG/3EGdevices.

Size of Board : 50mmx 60mm

No. of layers: 12 (with blind and buried vias)

Carrier Board

The Carrier Card is designed to interface with MPSoC SOM. The carrier card is designed with high speed interfaces like 2xGBE, ADC (ADS6245), Gigabit Display Port, 32 Bit SD Card interface, GPS, DMC, USB-UART, and USB2.0.The board can be powered using 48V POE or 12V DC Jack. The board is designed with Silent switcher to provide clean power supply to analog interfaces.

PCB Size-100mmx 230mm

No. of Layers-10

Roles & Responsibilities

  • Input Analysis
  • HDD, SDD, ATP, Requirement Specification ( Design Documentation) - Preparation
  • Power and Clock Analysis
  • Circuit Simulation & Circuit Analysis
  • PCB Support and PCB-Design Review till Gerber Release
  • Thermal, Power and Signal Integrity Analysis and Simulation
  • Support for Fabrication and Assembly
  • Basic testings, Functional and application testing
  • Chamber testing
  • Support to Software-Team for Bring up software
  • Cross-Functional Team support
  • Deliverable Documents

Asociate Hardware Design Engineer

Eldaas Technologies Pvt. Ltd
Bangalore
04.2019 - 08.2021

Digital Computing system

Di-ComS is a Digital Computing System supports RISC, COM Express and HD Audio Codec Module. This Module is designed with Intel atom which is having clock rate 1.91GHz and cache memory of 2MB. Di-ComS will support PCIe Gen2, USB3.0, USB2.0, Gigabit Ethernet, Intel HD Graphics, SD Card and HD Audio Interface. It is integrated with HDMI and LVDS Display. Di-ComS support different SOMs with single, dual and quad-core processors with Q7 Rev2.0 Form Factor

Roles & Responsibilities

  • Input Analysis
  • HDD,SDD, ATP, Requirement Specification ( Design Documentation) - Preparation
  • Power and Clock Analysis
  • Circuit Simulation & Circuit Analysis
  • PCB Support and PCB-Design Review till Gerber Release
  • Thermal, Power and Signal Integrity Analysis and Simulation
  • Support for Fabrication and Assembly
  • Basic Testings, Functional and application testing
  • Chamber testing
  • Support to Software-Team for Bring up software
  • Deliverable Documents

COM EXPRESS10 Carrier Card

This Board is designed with PCIe Gen2, Ethernet, SATA-III, HDMI, USB3.0, USB2.0 Interfaces .Input power supply to the board is 28V ,COM EXPRESS10 Module will mount on this for Validation purpose

Roles & Responsibilities

  • Input Analysis
  • HDD,SDD,ATP,Requirement Specification ( Design Documentation) - Preparation
  • Power and Clock Analysis
  • Circuit Simulation & Circuit Analysis
  • PCB Support and PCB-Design Review till gerber Release
  • Thermal, Power, and Signal Integrity Analysis and Simulation.
  • Support for Fabrication and Assembly
  • Basic testings,Functional and application testing
  • Chamber testing
  • Support to Software-Team for Bringup software
  • Deliverable Documents

Education

B.Tech - Electronic Engineering

Vignan Institute of Technology And Management
Odisha,India
03-2019

Skills

  • Circuit simulation
  • Thermal integrity
  • Power integrity
  • Signal integrity
  • Interface validation
  • System block diagramming
  • Component analysis
  • Hardware development/ Design
  • Circuit design
  • Analog electronics
  • Cross-functional collaboration
  • Digital electronics
  • Hardware documentation
  • High-speed design
  • Component selection
  • Bill of materials management
  • Mixed-signal design
  • Signal integrity analysis
  • Hardware debugging
  • CAD tools proficiency
  • Schematic capture
  • Digital circuit design
  • Requirement analysis
  • Problem solving
  • Functional testing
  • Power electronics design
  • Team Lead Capability
  • Project Management

Protocol

  • I2C
  • UART(RS422/RS232/RS485)
  • SPI
  • CAN/CAN-FD
  • Ethernet(RGMII/RMII/SGMII)
  • USB
  • PCIe
  • DDR1/DDR2/DDR3/DDR4
  • LPDDR1/LPDDR2/LPDDR3/LPDDR4
  • eMMC/ NOR Flash/ Quad SPI
  • FPGA
  • SoC/MPSoC
  • USB2.0/USB3.0
  • POE
  • SERDES
  • HDMI/VGA/DP
  • Audio/ Video Interface
  • DMC/GPS
  • RTC
  • LVDS
  • High speed Interface

Tools & Instruments

Circuit Design- Cadance( ORCAD), Altium, Concept HDL, Zuken, Mentor Graphics

Circuit Simulation-  LT Spice, ADS, TINA

Port Assignment-  MPDM

PCB CAD tools-VisECAD, Allegro, Altium

PCB Simulation- HyperLynx, Sigrity, Mentor Graphics

SW Development- Keil uVersion, Vivado

Debugger-PLS/UDE, Lauterbach

Instruments-DMM,Power Supply, DSO, Signal Generator, Spectrum Analyzer, Temperature Chamber

Languages

Odia
First Language
English
Proficient (C2)
C2
Hindi
Proficient (C2)
C2
German
Beginner
A1

Certification

  • SI/PI Certification by Keysight
  • High-Speed Digital Design & SI/PI Training – by Eric Bogatin

Accomplishments

  • Best employee of year
  • Star of the Month
  • signal/Power Integrity Expert from Keysight

Timeline

Senior Hardware Design Engineer

Bosch Global Software technologies
03.2023 - Current

Senior Hardware Engineer

Larsen & Turbo
03.2022 - 02.2023

Junior Electronics Engineer

Centum Electronics Pvt. Ltd.
08.2021 - 03.2022

Asociate Hardware Design Engineer

Eldaas Technologies Pvt. Ltd
04.2019 - 08.2021

B.Tech - Electronic Engineering

Vignan Institute of Technology And Management
Sibani Bebarta