Sourav B M

• Knowledge about the packaging process from bump to ball mapping in both wirebond and Flipchip technologies.
• Worked on 6nm technology in designing the covercell structures for the IO pads.
• Expertise in using OrbitIO system planner, also worked on the source code for customizations.

• Also solved the issues faced by the users with the tool.
• Beanshell which is also called as Java scripting, mainly used language for creating the automation scripts for the design.
• Used python scripts to extract the data from the IOD file to create the input files for the EDA tool.

• Also have the basic knowledge about the Innovus tool workflow.
• Worked on research areas like 2.5D and 3D stacking technology.

• Understanding the technologies in the packaging process.
• Creating the bump and ball placements on the die.
• Analysing the source code of the EDA tool OrbitIO system planner.
• Establishing connections with the peers.

• Worked on developing a web interface for the IOT based robotic Arm.
• Created test codes for the quad legged spider robot.
• Assisted fellow worker to understand the code of the web interface.