Summary
Overview
Work History
Education
Skills
Accomplishments
Timeline
TRAINING ASPECTS
Our Responsibility
DOMAIN EXPERIENCE
Rework Station
Declaration
Generic

SUNIL KUMAR

Maddur

Summary

To seek a position where I can utilize my skills and abilities that offer professional growth while being resourceful, innovative and flexible and contribute for the growth of the organization.

Overview

12
12
years of professional experience

Work History

Associate II-Lab Support

US technology international ltd
02.2024 - Current

Service Engg

CTDI At Regenersis India Pvt LTD
04.2017 - 01.2024

Service Engg

Regenersis India Pvt LTD
02.2014 - 04.2016

Education

ITI(EM) -

Vivekananda ITI College
Maddur
03-2013

SSLC -

Govt. High School
Niluvagilu
03-2011

Skills

Quick Learner

Open to learn to new technicalities

Accomplishments

  • Performed BGA replacement of Val-Tex chip to Samsung 5G – Network cards and appreciated by customer
  • Performed BGA replacement of Altera and Val-Tex chip and various types of TPN components to Tejas Network cards and appreciated by customer
  • Performed chip replacement in DELL Switch motherboards
  • Performed BGA Socket replacement in Lenovo and Dell server motherboards

Timeline

Associate II-Lab Support

US technology international ltd
02.2024 - Current

Service Engg

CTDI At Regenersis India Pvt LTD
04.2017 - 01.2024

Service Engg

Regenersis India Pvt LTD
02.2014 - 04.2016

ITI(EM) -

Vivekananda ITI College

SSLC -

Govt. High School

TRAINING ASPECTS

  • IPC-A610, 7711/21 Series and J-Std Service -Accessibility of Electronic Assemblies/ Rework, Modification and Repair of Electronic Assemblies.
  • Advance soldering training for BGA, SMT, and PTH.

Our Responsibility

  • Preparing profile board for the new product.
  • Preventive Maintenance and reports for Soldering Machine (Fonton 936, PDR-i3, OKI, Shuttle-Star)
  • Experience in PCB pallets handling intact avoiding PCB bends and alignments
  • Machine operator training and development/ cross Training.
  • Process Control and Product profile development for reflow and Replace SMT & BGA Operation for New and Exit product.
  • Operating the DAGE real time X-ray machine ensuring the BGA’s solder ability.
  • Providing support for Functional Repair(FR) and FCT (Functional Circuit Test)

DOMAIN EXPERIENCE

Profile Summary Core Competencies Technical Skills & Experience Process Improvement Key Responsibilities

Experienced Electronics Manufacturing Professional with strong expertise in SMT, BGA rework, and PCB-level troubleshooting. Skilled in process control, machine maintenance, and new product introduction (NPI). Proven ability to ensure high-quality standards, pass customer audits, and improve processes through continuous improvement methods.

  • SMT & BGA Rework Operations
  • Process Control & Reflow Profile Development
  • PCB Handling & Alignment Techniques
  • Functional Testing (FCT) & Functional Repair (FR)
  • X-Ray Inspection (DAGE System)
  • Preventive Maintenance of Soldering Equipment
  • ECO/ECN Implementation & Firmware Flashing
  • Kaizen & Continuous Improvement
  • Operator Training & Skill Development

BGA Rework & Soldering

  • Performed BGA rework using machines: Fineplacer Matrix, Finetech Core, Fonton 936, PDR-i3, OKI, Shuttle-Star
  • Expertise in pad rebuilding and BGA reballing
  • Strong knowledge of BGA baking process and solderability standards
  • Experience in Mini Pot (PTH) and SMD soldering

Process Engineering

  • Developed and optimized reflow profiles for new and existing products
  • Created process profiles based on customer requirements
  • Supported New Product Introduction (NPI) and engineering changes (ECN/ECO)

Inspection & Quality

  • Operated DAGE real-time X-ray system for BGA inspection
  • Ensured solder joint quality and defect-free assemblies
  • Successfully passed customer audits with high satisfaction

Testing & Troubleshooting

  • Performed Functional Circuit Testing (FCT) and Functional Repair (FR)
  • Troubleshot motherboards at component level (SMD, PTH, chip-level)
  • Used electronic measuring instruments and test software

Component & Hardware Knowledge

  • Replaced CPU sockets: LGA-1150, 1151, 1155, 2011, 2066, 3647
  • Worked with Intel chipsets (SR series), AMD CPUs, PCH, and GPU chipsets
  • Experienced in I/O component (SMD) replacement

Firmware & Programming

  • Performed ECO flashing using customer tools and Dediprog
  • Updated onboard chipsets and firmware manually

Production Support

  • Maintained PCB pallet integrity to avoid bending and misalignment
  • Managed preventive maintenance and reporting for soldering machines
  • Identified motherboard parts and handled component indents

Training & Leadership

  • Conducted operator training and cross-training programs
  • Supported team skill development and process standardization
  • Identified process gaps and reduced human errors
  • Implemented Kaizen and quality improvement initiatives
  • Escalated critical issues to R&D and product management
  • Prepared process/profile boards for new products
  • Managed SMT and BGA operations for new and existing products
  • Ensured compliance with quality and customer requirements
  • Supported production, repair, and testing teams

Rework Station

Expert in Mini Pot (PTH soldering) and SMD soldering processes.

Declaration

I, Sunil Kumar hereby declare all the documents are true to the best of my knowledge.  

PLACE: Bangalore                                                                                Yours Truly, 

                                                                                                              (Sunil Kumar)

SUNIL KUMAR