SUSMITHA DIAS
Bangalore
Summary
"Creative and detail-oriented PCB Designer with a strong background in electronics and circuit design. Proficient in CAD tools and adept at translating complex schematics into efficient, manufacturable layouts. Known for optimizing designs to enhance performance, reduce costs, and meet tight deadlines. Passionate about innovation and delivering high-quality solutions in fast-paced environments."
Overview
5
5
years of professional experience
Work History
Hardware Engineer
Honeywell Technology Solutions
02.2024 - Current
- Part Of Library team in Honeywell for supporting various business units within the company with library component creation in Xpedition EDM tool.
- 3D Model integration on existing library database footprints.
- Implemented and suggested kaizens to reduce cycle time and to work efficiently.
- Adhering to the process and checklist to make sure the parts are processed.
Pcb design engineer
Axiom Research Lab
09.2022 - 01.2024
- PROJECT NAME : APX-EPS-BPC
- LAYERS : 08
- BRIEF ON PROJECT : In this project I have used VA416XO-DS-1. 9 RS232_CONFIG(M )
- IC : (SN54LS244CR)
- Types of interface used : UART, ADC Signals High efficiency switching mode regulators such as 5A,10A -RECOM Type Regulators are used
- Types of connectors : PPS connectors,D-SUB connectors,berg Sticks(pitch 1.25 mm) Handled this project from footprint creation,layout and Gerber.
- Tools : Altium 23
- PROJECT NAME : ENG-CAM
- LAYERS : 06
- BRIEF ON PROJECT : In this project we have used camera sensor as BGA of 0.4mm drill RS422_CONFIG(M )
- IC : (HS-26CLV32RH) Types of interface used : UART, ADC Signals, LDO High efficiency switching mode regulators such as 5A,10A -RECOM Type Regulators are used
- Types of connectors : PPS connectors,D-SUB connectors,berg Sticks(pitch 1.25 mm) Handled this project from footprint creation,layout and Gerber. Tools : Altium 23
- Retested electrical products and systems to determine effect of modifications
PCB DESIGN ENGINEER
V3 NOVUS PVT LIMITED
02.2022 - 09.2022
- PROJECT NAME : NAV EVAL BOARD
- LAYERS : 04
- BRIEF ON PROJECT : In this project I have used OEM GNSS MODULE (NT103.SMT) , 1 RS232_RTCM_CONFIG(MAX3232CSE ) , BUFFER IC(SN74LVC1G17DBVR)
- Types of interface used : UART, ADC Signals High efficiency switching mode regulators such as 5A,10A RECOM Type Regulators are used
- Types of connectors : PPS connectors , D-SUB connectors , berg Sticks(pitch 1.25 mm) Handled this project from footprint creation ,layout and Gerber.
- Tools used : Allegro 17.4
- PROJECT NAME : INTERIAL MEASUREMENT UNIT
- LAYERS : 04
- BRIEF ON PROJECT : In this project we have used Arm Microcontroller (STM32F401CBU6) With 128 KB Memory & 32 bit Single Core &48 qfn package
- Type of Interface used: Uart (RS232,RS422)& SPI signals (ISM330DLCTR) High efficiency switching mode regulators such as 5A,10A RECOM Type Regulators are used
- Types of connectors : berg stick of 5 position (1.27 mm) Handled this project from footprint creation,layout and Gerber.
- Tools used : Allegro 16.6
PCB DESIGN ENGINEER
Bharat Electronics Limited
12.2019 - 01.2022
- PROJECT NAME : VVPAT CONTROL UNIT
- NO OF LAYERS : 14
- BRIEF ON DESCRIPTION : SIGNAL PROCESSOR IC(FINE PITCH BGA)WITH COMBINER AND MULTIPLEXER ICS AND INTERFACE CONNECTOR Handled this project from footprint creation,layout and Gerber
- Tools used : Allegro 17.4
- PROJECT NAME : EVM SIMULATION BOARD
- NO OF LAYERS : 06
- BRIEF ON DESCRIPTION : SIGNAL PROCESSOR IC WITH COMBINER And MULTIPLEXER ICS AND INTERFACE CONNECTORS WITH USB(2.0/3.0)
- Handled this project from footprint creation,layout and Gerber
- Tools used : Allegro 17.4
Education
Diploma in electronic and communication engineering -
MES RNSHETTY POLYTECHNIC SIRSI
2020
SSLC -
St. Anthony's English Medium Higher Primary School
2016
Skills
- Worked on High Speed technologies like USB(20/30), HDMI, Ethernet(Fast/1G/10G), MSATA, PCIe interface, DDR3, eMMC, ADC signals, DVI, QSFP and VGA
- Worked on Cadence Allegro and Mentor graphics Hyperlinx, Altium, Gerber viewer and Ecad tools
- Worked on High Density interconnect boards, Analog, Digital, RF and Power supply boards
- PCB footprint creation followed IPC standards such as IPC-7351 and IPC-2221 Worked Multi Layer PCB boards up to 14 layers
- Expert in designing Multilayer PCB involved in placement, routing, length matching, Gerber generation
- Experience on Differential pair signal Routing, length matching & controlled impedance and layer stack up
- Worked on Impedance calculation based on stack up details using Saturn Tool Awareness of EMI/EMC Power analysis, Thermal analysis and Signal Integrity issues in design level
- Adaptable to work in highly stressed work environment without losing patience and enthusiasm
Languages
English
Advanced (C1)
KANNADA
Bilingual or Proficient (C2)
Hindi
Bilingual or Proficient (C2)
Timeline
Hardware Engineer
Honeywell Technology Solutions
02.2024 - Current
Pcb design engineer
Axiom Research Lab
09.2022 - 01.2024
PCB DESIGN ENGINEER
V3 NOVUS PVT LIMITED
02.2022 - 09.2022
PCB DESIGN ENGINEER
Bharat Electronics Limited
12.2019 - 01.2022
Diploma in electronic and communication engineering -
MES RNSHETTY POLYTECHNIC SIRSI
SSLC -
St. Anthony's English Medium Higher Primary School
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