Syed Arshad Junaid
Nanpara
Summary
Energetic Mechanical Engineer with approx. 8 years of experience, seeking to use design and analysis skills to advance simulation excellence. Expertise in Statics, Dynamics and Thermomechanical analysis using FEA tool predominantly Ansys.
Overview
8
8
years of professional experience
1
1
Certification
Work History
Lead Engineer
HCL Technologies
Bangalore
02.2022 - Current
- To perform the structural integrity analysis for the different assembling stages involved in the integration of Antenna assembly
- To study the critical PCB packages and recommend the design changes
- To lead a team of Engineers for other projects.
Application Engineer-FEA analyst
CoreEL Technologies
Bangalore
07.2017 - 02.2022
- Primary responsibility is to provide technical support to the A&D and PSU sectors
- Perform the FE analysis of the electronic boards, PCB carriers and chassis to study their structural integrity and reliability
- Collaborate with Design team to develop solutions within timelines.
Project Engineer
Indian Institute of Technology Bombay
Mumbai
04.2016 - 06.2017
- Heat transfer in rarefied gases", sponsored by Department of Science and Technology (DST), India
- Following were the tasks carried out in the project work: Perform temperature and pressure measurements in rarefied gas flowing through a tube
- Calculate the heat transfer coefficient for various levels of rarefaction.
Education
M. Tech - Design Engineering
BITS Pilani
B. Tech - Mechanical Engineering
Babu Banarasi Das Northern India Institute of Technology (BBDNIIT)
Skills
- CAD - ANSYS SpaceClaim, ANSYS ACP for Composites modeling
- MESHING - ANSYS Meshing, Hypermesh (Beginner level)
- ANALYSIS - ANSYS Workbench (Static & Dynamic analysis, Fatigue analysis, Linear & NonLinear analysis, Thermo-mechanical analysis, Explicit Dynamics analysis), ANSYS Sherlock & Ansys ACP (Pre & Post) Composites analysis
Certification
- Ansys Certified Professional, Structural - Technical
- Ansys Certified Professional, Ansys SpaceClaim - Technical
- Completed certificate course of AUTOCAD.
Personal Information
- Father's Name: Mr. Syed Junaid Asad
- Date of Birth: 08/27/1993
- Nationality: Indian
- Marital Status: Single
Projects
Solder Fatigue for BGA of Chips, The objective was to estimate the characteristic life of Solder BGA. The system was exposed to cyclic thermal shock load and the characteristic life was calculated for the solder balls and compared against the practical test data which was found to be in good co-relations. Pin insertion analysis for PCB Assembling process, The objective was to study the pin insertion force required for assembling process and its impact on the PCB components. Drop test for ADAS Camera Module, To study the strength of the camera module when dropped from 1 meter height. The critical components were assessed and iterated to attain the expected outcomes. Thermo-mechanical analysis for Radar Assembly, The objective was to study the behaviour of PCB when exposed to Thermal shock loads and identify the critical electronic chips & packages by referring the allowable strain limits. Vibration analysis for Antenna Structure of Radar, The objective was to study the static and dynamic behaviour of the Antenna structure. A pre-stressed Modal analysis followed by Harmonic loads, Random vibration PSD loads & Shock loads were performed and the weak regions were located based upon the response. Izod impact test on a composite plate, The objective was to study the energy absorbed by the test specimen (made up of composites) during an Izod impact test before its failure. The composites component created was analysed for the pendulum impact and the energy absorbed by specimen was studied. Fatigue study of Connecting rod (Engine applications), The objective was to maintain the life cycle of a connecting rod while the Engine power was increased (the major dimensions of con rod were fixed). Deep drawing analysis of sheet metal, The objective was to simulate a two-stage deep drawing of sheet. The two-stage drawing was carried out for the sheet metal to study the sheet thickness reduction & spring back effects. Water entry impact of Torpedo, The objective was to study the accelerations generated on the critical components of a torpedo while entering a water body at different angles. System level Reliability analysis of the Electronic PCB Card, The objective was to study the reliability and life prediction for the PCB boards. A system level reliability analysis was performed to study the life prediction of PCB while considering the effects of enclosure assembly.
Disclaimer
I do hereby declare that the above information is true to the best of my knowledge.
Timeline
Lead Engineer
HCL Technologies
02.2022 - Current
Application Engineer-FEA analyst
CoreEL Technologies
07.2017 - 02.2022
Project Engineer
Indian Institute of Technology Bombay
04.2016 - 06.2017
M. Tech - Design Engineering
BITS Pilani
B. Tech - Mechanical Engineering
Babu Banarasi Das Northern India Institute of Technology (BBDNIIT)