Tejan Thakar

Product Requirements & Specifications

• Understand end-use application (consumer electronics, automotive, medical, IoT, etc.).
• Define power, speed, form factor, cost, and reliability requirements early.
• Ensure compliance with product certifications (CE, FCC, UL, RoHS, ISO for automotive, etc.).

PCB Layout Best Practices

• Stack-up design: Decide layer count based on signal integrity, EMI/EMC, and cost.
• Impedance control: Differential and single-ended traces (USB, Ethernet, PCIe, DDR).
• Power delivery network (PDN): Minimize voltage drop, noise, and ensure decoupling.
• Signal integrity: Short traces, length matching, controlled routing for high-speed nets.
• Thermal design: Heat spreading, thermal vias, copper pours, placement of power components.
• Placement priority: Critical components (MCUs, BGAs, power ICs) placed first, then passives.
• Design for testability (DFT): Add test points, headers for debugging.

Manufacturability (DFM & DFA)

• Follow minimum track width, clearance, drill sizes per manufacturer’s capability.
• Ensure via types (through, blind, buried) match production cost and yield goals.
• Avoid acute angles, acid traps, and tight spacing.
• Optimize for assembly yield (component spacing, orientation, silkscreen clarity).

Reliability & Safety

• Meet creepage and clearance rules (especially for high-voltage boards).
• Ensure EMI/EMC compliance with proper grounding, shielding, and filtering.
• Perform derating analysis for power components.
• Apply redundant vias for high-current paths.

Cost & Supply Chain

• Optimize PCB layer count (fewer layers = cheaper, but balance with performance).
• Use standard board thickness (1.6 mm) unless product requires otherwise.
• Select components with alternate suppliers to avoid shortages.
• Consider assembly costs (SMD vs THT, hand soldering vs pick & place).

In short:
A product-based PCB design must balance performance, reliability, manufacturability, compliance, and cost-efficiency — because once it goes to mass production, redesigning is extremely expensive.

· Joining as a front end engineer linke using U-CAM tool.

· After 6 month company given opportunity for footprints preparation in PCB Library Expert Pro.

· I have 6 year work as a footprints and front end assembly engineer.

· Seen last two year company given another opportunity for work as a PCB design engineer.

· Schematic capture, layout, and component creation using AltiumDesigner.

· Contributed to component library development for schematic symbols, part parameters, and footprints per IPC standards.

· Generating PCB & Assembly Documentation: BOMs, Pick & Place, Fab and Assembly Drawings.

· Designing independently and with other engineering teams.

· Doing quality check before releasing final gerber data includes schematic, components' pin out, Bill of Material and layout feasibility verification.

· Clear understanding of design for manufacturability (DFM), design for assembly (DFA)

· Preparing the Footprints of various type of components using PCB Library Expert CAD library development tool.

· Ability to read, analyze and interpret component datasheet

· Analyzing and preparing customer data, Bill of material (BOM) and Component placement list (CPL)as per customer data on PCB Boardbefore Assembly production.

· Maintain component library/database

· Sourced the components and suggested alternates if required.

· Immense ability to evaluate and recommend components.

· Coordinated with the design engineers to evaluate the components andstandardize the selection process.

· Used to check the designs thoroughly and was also responsible for creating technical design query documents for clients.