Dynamic engineering professional with extensive experience in Support PCB Design and Project management Support, recognized for driving innovation support and efficiency in high stakes environments. Proficient in ECAD/CAM support integration with PLM/ERP and adept at leading & Training teams to achieve design excellence and product reliability support. Proven ability to translate complex technical requirements into actionable projects, enhancing operational workflows and delivering superior results.
●Over all 14+Years of functional experience in EAD/CAD support and simulation support I bring expertise in support various domains crucial to this Professional Environment.
● I will be responsible for the complete layout PCB Process activities from Schematic support to Design review DFx and Fabrication Gerber simulation support and handling individually up to 20 layers with stackup selection impedance calculation guide support, Rigid-Flex PCB guide support, several BGA’s >2K Pins, fine pitch FBGAs with Blind and Buried Via design techniques, HDI Micro via - Stacked and Staggered Micro vias & Back drill VIA, signal length matching support.
● Good and timely interaction with cross-organization global functional teams as well as the HW team support / Mcad development team support for the new product introduction (NPI) Processes requirements, HW twin Designs (LTspice simulation), MBD simulation and daily updates-using mail, Product PLM & PDM support tools.
● Major Key projects involved: EV MCU (BLDC/PMSM Motor), fast Charger and BMS, Intel CPU and SoC chip boards, ECU & ECS boards, Network boards, mixed signal boards, communications systems – GSM, LTE, Avionics, Defense boards, Automotive boards, Tablet PC boards, Power Electronics boards, Analog, RF and ATE Platform boards
● Worked in Interfaces DDR5, DDR4, PCIe, Ethernet, SATA, HDMI, MIPI, USB, I2C and QSFP socket interfaces and constraints setting setup support for The CAD members and support IT team.
● The layout technique for High-speed designs as well as EMI, EMC, Cross take, Reflection, Power plane, track width creepage spacing, Impedance calculation, copper thickness, Control Impedance skew, Stackup and HS Length matching, Mechanical skew Problems, DFM, DFA, DFT and PCB Manufacturing Process considerations during layout work.