Varun M
Summary
Looking for a career that supports continuous learning, encourages hands-on experience with new technologies, and helps me grow both personally and professionally while strengthening my skills in PCB design.
Overview
3
3
years of professional experience
1
1
Certification
Work History
Design Engineer
Coreel Technologies India Pvt Ltd
07.2022 - Current
- Working as a Design Engineer, contributing to advanced PCB design for defense and aerospace systems, taking care of signal integrity.
Education
B.Tech - Electronic Engineering
BITS Pilani – WILP
12.2026
Diploma - Electrical and Electronics Engineering
Rajagopal Polytechnic College
04.2022
HSC - Bio-Maths Stream
M.A.M. Matric Higher Secondary School
03.2020
SSLC - undefined
M.A.M. Matric Higher Secondary School
03.2018
Skills
- Experienced in mixed signal (Analog, Digital) with separate ground reference, RF and Power supply Boards designs
- Design Experience with interfaces/standards: DDR, PCI-Express, USB, ETHERNET, SATA and HDI technology
- Interactive with Hardware, Mechanical and Fabricator
- Adequate knowledge on DFM and DFA to ensure successful & cost-effective manufacturing/assembly in design stage itself
- Good knowledge in Micro/Laser, blind & buried Vias and Back dill
- Basic knowledge in SI, PI, EMI/EMC in PCB boards
- Hands-on experience in checking and validating Gerber
Additional Information
Allegro Versions: 15.5, 17.4, and 23.1
PADS Versions: VX 2.12 and VX 2.14
Schematic Tools: OrCAD Capture and PADS Logic
CAM Tool: CAM350 (used for Gerber verification, IPC checks, and DRC validation)
Certification
I manage the complete PCB design cycle, starting from footprint creation, netlist import, and component placement, through fan-out, constraint setup, routing, length matching, and power plane definition. I also handle non-electrical aspects such as fabrication, assembly, and silkscreen layers, leading up to Gerber generation and final release
Accomplishments
Project: M24 Processor Card – Missile Target Seeker Application
Role: PCB Design Engineer
Duration: 30 Days
Tools Used: Allegro 23.1 Ver
Description:
Designed an 18-layer high-speed PCB for a missile target seeker, featuring a 23×23 BGA FPGA (0.8 mm pitch), 64-bit DDR, and Ethernet interface with over 600 components and 800+ nets.
Layout optimized for controlled impedance, signal integrity, EMI/EMC compliance, and thermal performance.
Project: TFER 18-40 GHz – Radar Application
Role: PCB Design Engineer
Duration: 30 Days
Description:
Designed in 8 layer board is an Down convertor card which down converts the wide range of 18-40Ghz to 2-17Ghz signal. By using HDI technology and CPWG via stitching to make sure proper transmission of signal.
Languages Known
Tamil
English
Kannada
Disclaimer
I hereby declare that the above-mentioned details are true to the best of my knowledge.
Place:
Date: Varun M
Timeline
Design Engineer
Coreel Technologies India Pvt Ltd
07.2022 - Current
Diploma - Electrical and Electronics Engineering
Rajagopal Polytechnic College
HSC - Bio-Maths Stream
M.A.M. Matric Higher Secondary School
SSLC - undefined
M.A.M. Matric Higher Secondary School
B.Tech - Electronic Engineering
BITS Pilani – WILP
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