To pursue a challenging career in Physical Design where I can apply my skills towards creating the next generation ASICs, SOCs, PROCESSORs.
Lead chip level RTL2GDSII physical design team. (3 tapeouts)
4 successful tape outs at high performance IP group delivering vector processors and subsystems to next gen modems.
Responsible for Block Level and subsystem level Netlist2GDSII closure.
ADI- Spot award in for FY20,FY21
Qualcomm- Qualstar award for Q2’16 and Q3’17.
SmartPlay - SPOT-LIGHT award by PMC-SIERRA in Q3 of 2015.
SmartPlay - Special appreciation award for Q2’13 and Q3’14.