RAKESH
JUNIOR ENGINEER
Bengaluru
Summary
Junior Engineer delivering board-level repair, debugging, and failure analysis for Projects Handled electronics manufacturing workflows. Applies root cause analysis, component replacement, and technical reporting to improve repair yield and support NPI builds. Partners with Quality, Manufacturing, and Engineering teams to drive CAPA actions and process efficiency.
Overview
5
5
Languages
5
5
years of professional experience
Work History
Junior Engineer
Flextronics Technologies India Pvt. Ltd.
09.2022 - Current
- Improve repair yield by [number]% through CAPA follow-up and root-cause analysis of recurring defects.
- Resolve [number] board-level faults per shift through troubleshooting, component replacement, and failure isolation.
- Lead repair, debugging, and failure analysis for assembled boards in a junior engineering environment.
- Support R&D builds, NPI activities, and engineering change implementation during product transitions.
- Coordinate with Quality, Manufacturing, and Engineering teams to align debug priorities and resolve production issues.
- Apply process feedback from defects and CAPA actions to strengthen repair flow and process efficiency.
- Handled NPI units here, worked on Networking devices configuration and written test cases for network device using Linux to interface networking boards using apollo testing software.
- Responsible for testing Cisco Network Interfacesi.e. CAT6K& CAT7K series, ISR, DSBU seriesrouters, switches, CAT6K Chassis, N9K, UCS, NCS, ASR, C9400 servers and FIT.
- Basic configuring the CAT6K Switches& Routers, Building network setup, configuring and maintenance of testing of CISCO routers and Switches.
Technician
Centum Electronics
03.2022 - 08.2022
- Performed precise SMT and through-hole PCB rework, replacing fine-pitch QFP and BGA components with hot-air rework stations.
- Performed board-level troubleshooting, electronic board testing, and component replacement to support debug and rework.
- Applied Why-Why analysis and failure analysis to trace recurring board defects and support corrective action.
- Supported production quality improvement and NPI activities through assembly process checks, technical reporting, and cross-functional coordination.
Education
Diploma - Electronics and Telecommunication Engineering
Government Polytechnic Bantwal
01-2021
Skills
NPI
Why-Why analysis
Assembly process
Failure analysis
Board-level troubleshooting
Component replacement
Electronic board testing
R&D build support
Engineering change implementation
IPC-A-610 certification
Soldering rework
Oscilloscope operation
Multimeter testing
Circuit tracing
Linux(Kernel)
Computer networks
Configuration of Cisco Routers and Switches
MS Office
Testing Software:Apollo
Root cause analysis
CAPA implementation
Repair yield improvement
Technical reporting
Cross-functional coordination
Failure mode effects analysis
First article inspection
Process validation
Defect analysis
Non-conformance reporting
Production quality improvement
Production planning
Line balancing
Timeline
Junior Engineer
Flextronics Technologies India Pvt. Ltd.
09.2022 - Current
Technician
Centum Electronics
03.2022 - 08.2022
Diploma - Electronics and Telecommunication Engineering
Government Polytechnic Bantwal