Summary
Overview
Work History
Education
Skills
Accomplishments
Additional Information
Declaration
Timeline
Generic

Shashank Shankar Mitta

Bengaluru

Summary

With over a decade of experience as high-speed designer and a Master's degree in Electronics & Communication,seeking an engaging career in a reputable company where my interpersonal skills and contribute meaningfully to the organization's growth.

Overview

11
11
years of professional experience

Work History

Technical Lead

Tessolve Semiconductor Private
2022.08 - Current

Responsibilities :

  • Collaboration with client, designers, and stakeholders to define project requirements.
  • Provide technical support to internal teams by addressing complex hardware-related issues promptly and effectively.
  • Participate in schematics review,PCB review and SI & PI review and optimize the design to meet the design requirement.
  • Create detailed documentation for each design project, including specifications, schematics, and test results.
  • Effectively work at client and parent company to complete given task within timeline

Product Description :

The board is classical demonstrate of development board and it's designed to validate the different interface's PHY which are PCIE Gen5, MIPI CSI C/D- phy, DSI D-phy, UFS M-phy, Type-C Gen 3.1

The board gets power up through PMIC from main front end regulator and charging IC. It also supports low speed interface such as I2C,SPI, UART and user GPIOs are break out to enable the stake holder to validate the PLL features.

Senior Design Engineer

Wipro Technologies
2019.01 - 2022.08

Responsibilities:

  • Defined t AIC's Power Delivery Architecture for 75W form factor Entry level Graphics CARD Product
  • Cumulated and analysis information from different team to adhere product within specification
  • Equated system requirement within 75W technical specification
  • Optimized VR's solution with different topologies to align with PnP team's power number requirement
  • Closely worked with External Vendor to get technical information for finalize solution and meet Power up sequence requirement
  • Co-ordinate with Thermal & Mechanical Team for product enclosure
  • Closely worked with PCB layout Team
  • Additional analysis of the DCR and DCIR simulation result to optimize the design
  • Extended support and contributed efforts during the Power Supply Validation and Board Level Bring up
  • Extensive Validation for IMVP8 Controller based Graphics core buck converter using LPVRTT (i.e. Static Load Line, Transient Load Line, IMON calibration, Power Stage Transition Test, Rdroop Measurement, SVID Validation)
  • Contributed other Product's Features testing (i.e. Power Level Limitation, Psys Validation, D3C Cold condition,Input Power Multiplexing, Microsoft Modern Standby)

Product Description:

Desktop Graphics Card

The board has very specific product level requirement which was entry level graphics card for desktop PCIe interface form factor.

This product has custom graphics SOC, 6GB GDDR6, PCIe Gen4 x16, HDMI 2.1 & DP2.0 and unique IMVP8 Controller Buck Converter Solution.

The product was launched successfully in 2022.

Lead Engineer

HCL Technologies
2017.05 - 2019.01

Responsibilities:

  • Supported during Hardware Design Document requirements
  • Schematic Design and optimize Bill of Material
  • Prepared Layout guideline & work closely with PCB layout Engineer
  • Vendor communication during DFM and DFA
  • Define set of rule to validate design using FMEA, De-rating Analysis, Life time of product
  • Prepare document for In -Circuit Test (ICT) ,Functionality Circuit Test (FCT) and support in manufacture process

Product Description:

IUPC Medical Sensor

The main concept of the project is to design invasive medical sensor to measure uterine pressure when mother is pregnant. The product has two level isolation to prevent isolation failure.

The sensor gets connect with Main board over the USB 2.0 and supports 10-inch touch panel display to understand real time statistics

Hardware Design Engineer

eInfochips Private Limited
2013.07 - 2017.05

PROJECT DETAILS:

Smart City Street Light Control

Responsibilities :

  • Prepared Hardware Design Document
  • Co-ordinate with Mechanical Team for product enclosure
  • Schematic Design, component creation and prepared Bill of Material
  • Designed schematic of switching power supply
  • Prepared Layout guideline document
  • Work closely with PCB layout Engineer
  • Gerber review
  • Prepared Bring up & DVT Test Report

Product Description:

The main concept of the project is IoT based that controls the luminance of the LED light and monitor the live road traffic.

It consists of High Speed eMCP, USB2.0,10/100Mbps Ethernet, RF section Wi-Fi, GPS and LTE and Low speed interface like I2C, SPI. It supports multiple sensors that capture the real time data and supports Wi-Fi/LTE interface to share the data.

Product Specification:

  • Snapdragon Q410 Processor
  • PMIC PM8916
  • 1GB LPDDR3 RAM and 8GB eMMC Memory
  • 10/100 Mbps Ethernet Interface USB 2.0
  • WiFi b/g/n/ac,Bluetooth 4.0 and LTE support for Communication
  • GPS Support
  • Sensors - Temperature, Accelerometer, Ambient Light Sensor

Intrinsic Safe 3G Smart Mobile

Responsibilities:

  • Prepared Hardware Design Document
  • Co-ordinate with Mechanical Team for product enclosure
  • Schematic Design, component creation and prepare Bill of Material
  • Prepared Layout guideline document
  • Worked closely with PCB layout Engineer
  • PCB Layout Review & Gerber Review

Product Descriptions :

The product is simple 3G smart mobile and specifically designed for Oil-Gas Industry. The product is explosion proof and power with Snapdragon 410 processor with android supports. It supports USB 2.0, MIPI CSI interface for front camera, Micro SD card support for external storage, 3G radio communication and GPS support. My role was captured the customer requirement and designed product schematic. Also co-ordinate with Mechanical and PCB team.

Product Specification:

  • Snapdragon Q410 Processor
  • PMIC PM8916
  • 1GB LPDDR3 RAM and 8GB eMMC Memory
  • Micro SD Card Support
  • USB 2.0 Support
  • Bluetooth 4.0 Support
  • 3G Support for Communication
  • GPS Support
  • 5 MP Camera with Flash LED
  • 2.4" Display with 240X320 Resolution
  • 3.5 mm Headset jack and MIC support
  • Speaker and EAR piece for Audio support
  • Sensors - Gyroscope and Accelerometer
  • 1200 mAh Battery

Education

Master of Engineering - Electronics And Communications Engineering

SVIT
Vasad, India
07.2012

Bachelor of Engineering - Electronics & Communication

KIRC
Kalol, India
07.2010

Skills

  • Experience in Hardware Product Development life cycle
  • Experience in various interfaces like UART, SPI, I2C, USB2.0,LPDDR3,eMCP,MIPI CSI,MIPI DSI,SD Interface, Display port, HDMI, PCIe Gen4/5
  • Design product based on APQ8016 (Snapdragon™ processor) and Power Management Integrated Circuit (PMIC)Design
  • Power Delivery Solution for standard AIC 75W form factor
  • Design PDN for high current based buck converter (i.e. IMVP controller Solution)
  • Experience in 3 mil/ 3 mil PCB Layout Technology up to 10 layers board with Blind/buried, micro via technology and PTH technology
  • Good debug and Testing Skills with equipment like Digital Oscilloscope, Multi-meter, DC Load & Bench Power Supply
  • Good Experience on SOC's core power rail Load line , IR Drop, Thermal and Transient analysis
  • Hands on experience in Wi-Fi, Bluetooth and GPS communication protocols
  • Hands on experience in designing of Intrinsic safe standard product
  • Experience in Product validation using Failure mode effects (DFMEA) and Analysis & Component De-rating Analysis
  • In depth experience with Microsoft office tools, Cadence Concept HDL, OrCAD, Cadence Power DC, Allegro PCB Viewer

Accomplishments

  • Received ' Team Player' award for executing the project on stipulate time
  • Received 'Pat On The Back' award for diligent work in PCB Design and Mechanical modelling of Intrinsic Safe 3G Smart Mobile
  • Achieved ' Best Team Award' for Eragon-410 and Biometric Access System
  • Earned Core Value Awards - 'Disciplined Execution ' and 'Embrace Impossible Challenges' for Biometric Access System and Intrinsic Safe 3G Smart Mobile
  • Published paper on 'Various Methodologies for Stenography : It is Detection and Evaluation' in The Indian Journal of Technical Education,NCEVT-2012,ISSN-0971-3034
  • Published paper – “ 8 FACTORS TO CONSIDER BEFORE ADDING M2M CAPABILITIES TO YOUR MEDICAL DEVIC E” - Med Device Online

Additional Information

Personal Details:

Name : Shashank Shankar Mitta
DOB : 10-Nov-1986
Gender : Male
Marital status : Married
Nationality : Indian

Hobbies : Music, Travelling, Sports
Linguistic : English, Kannada, Hindi

Declaration

I here by declare that the above mentioned information is correct up to my knowledge and I bear the responsibility for the
correctness of above mentioned particulars.


Shashank Mitta

Timeline

Technical Lead

Tessolve Semiconductor Private
2022.08 - Current

Senior Design Engineer

Wipro Technologies
2019.01 - 2022.08

Lead Engineer

HCL Technologies
2017.05 - 2019.01

Hardware Design Engineer

eInfochips Private Limited
2013.07 - 2017.05

Master of Engineering - Electronics And Communications Engineering

SVIT

Bachelor of Engineering - Electronics & Communication

KIRC
Shashank Shankar Mitta