Hi, I’m
Hari Priya S
Design Engineer 1
Chennai
Summary
Experience with 1 year and 9 months as a Design Engineer. Looking for an opportunity to be a part of an organization that focuses on customer satisfaction and customer retention, and to utilize my interpersonal skills to achieve these goals. Creative and innovative prospect determined to bring ideas to life through cutting-edge technology and design techniques. Team player with strong problem-solving skills to contribute effectively to projects and teams. Considers unique and unconventional solutions to deliver exceptional results.
Overview
2
years of professional experience
5
years of post-secondary education
2
Certifications
3
Languages
Work History
Tessolve Semiconductor Pvt. Ltdchennai
Design Engineer 1
08.2022 - Current
Job overview
SDC300 CPU SUBSYSTEM
- Worked on testcase development with register configuration for General purpose Timer, WDT
- Increased the pass rate by debugging regression failures brought on by modifications to the RTL or verification environment
- Worked on checker's development
- Worked on code coverage and functional closure
- Actively worked with designers to achieve the project's objectives and timeframes.
Tessolve Semiconductor Pvt. Ltdchennai
Design Trainee
02.2022 - 07.2022
Job overview
UART, I2S
- Examined the design and functionality according to the specification
- Developed UVM Environment and config
- Developed the testcase to verify the valid data.
Education
Madras Institute of Technology, Chennai
Master of Engineering from VLSI Design and
Embedded System
12.2020 - 06.2022
University Overview
GPA: 8.31, FPAA Based Non-Invasive Measurement of Biomedical vital Parameter
Mepco Schlenk Engineering College
Bachelor of Engineering from Electronics and
Communication Engineering
06.2015 - 05.2019
University Overview
GPA: 8.07, Non-Invasive Haemoglobin Measurement Using Photoplethysmographic
Skills
Hardware Description Language- Verilog
Certification
Introduction to Programming in C”
Paper Published
Non-Invasive Haemoglobin Measurement Using Photoplethysmographic Technique
-“Non-Invasive Haemoglobin Measurement Using Photoplethysmographic Technique” in Volume 33 of the Lecture Noteson Data Engineering and Communication Technologies.
Timeline
Design Engineer 1
Tessolve Semiconductor Pvt. Ltd
08.2022 - Current
Design Trainee
Tessolve Semiconductor Pvt. Ltd
02.2022 - 07.2022
Madras Institute of Technology
Master of Engineering from VLSI Design and
Embedded System
12.2020 - 06.2022
Introduction on Internet of Things
04-2018
Introduction to Programming in C”
09-2017
Mepco Schlenk Engineering College
Bachelor of Engineering from Electronics and
Communication Engineering
06.2015 - 05.2019
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