Working as Director - ASIC Design at Alphawave Semi , talented with excellent employee development, customer service and analytics skills coupled with more than 23 years of experience. Comfortable giving engaging presentations to clients to drive new business, expand accounts and establish brand profile. Excellent team builder and leader of initiatives. Passionate about applying excellent organization and communication skills to manage and lead teams.
In Past, worked as SOC Design Engineering Manager at Intel India prior to Alphawave. Adept in complete closure of Physical Design (from RTL to GDS2) with added expertise in large Team Management. Expertise in driving complex projects to completion, managing large teams, and achieving SOC convergence. Skilled in PD, STA, DFT, DRC, Signal EM, IR analysis, etc and fostering a goal-oriented team environment, demonstrating exceptional leadership and technical prowess.
Encouraging manager and analytical problem-solver with talents for team building, leading and motivating, as well as excellent customer relations aptitude and relationship-building skills. Proficient in using independent decision-making skills and sound judgment to positively impact company success. Dedicated to applying training, monitoring and morale-building abilities to enhance employee engagement and boost performance.
Pursuing full-time role that presents professional challenges and leverages interpersonal skills, effective time management, and problem-solving expertise.
As Director, was directly involved in Focal discussions, Finance discussions and management decisions. Also an active member of the POSH team.
Few key highlights:
Key Projects Driven:
Networking SOCs for US based customer - Managing two large SOCs from the same customer - Switch & HFI, both in N7 (TSMC). Managing the complete PD, DFT and STA team from starting and included the PV and IR team towards the end. Overall a team size of close to 50 resources. Also managed the IT, compute planning, tool licenses, and anything that came under the purview of work.
Die Size: 24.6mm x 15.77mm, Package : HDBU (8-2-8)
SRAM Size : 351 MB, Signal I/Os : 897 TSMC 7nm Process
Die Size: 38mm2, SRAM Size : 83.5 MB,
Signal I/Os : 50 differential high-speed; 75 single-ended slow-speed
112G SerDes x 8 lanes (106Gbps used)
PCIe Gen5 x 16 lanes TSMC 7nm Process
Physical Design Manager (~1 year)
GNRD-IO Die - Managing a team of 35+ employees (internal and contract workers) to deliver the various milestones for 2 SubFCs (Tiles) and 1 SS in Physical Design. Horizontally, owning the FCT, Power Convergence & Quality team. Design is in Intel 7nm node.
SOC FCT Execution Lead and Manager (~2 years)
PVC Base Die SOC FCT - Managing Team of 35+ people towards the single goal of SOC FCT convergence. This also includes the noise and caliber (intel internal ruleset for quality)
ATS SOC FCT Manager - Managing Team of 25+ People towards the single goal of SOC FCT convergence. This also includes Noise and Caliber (intel internal ruleset for quality)
SOC Timing Lead for: (~5 years)
• Broadwell Chops - DE, LCC, MCC, HCC
Broadwell is the fifth model generation of Intel Processor. It's Intel's codename for the 14 nanometer die shrink of its Haswell micro-architecture. It is a "tick" in Intel's tick–tock principle as the next step in semiconductor fabrication. Like some of the previous tick-tock iterations, Broadwell did not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there were no low-end desktop CPUs based on Broadwell
• BDXNS-CPM
BDX-NS is an SoC derivative of Broadwell Server-DE (Xeon D), a Xeon class server SoC product targeted for Network & Storage markets. The key changes in this Xeon SoC derivative with respect to the baseline product are the integration of Crypto Processing Module (CPM) IP on die to provide Intel QuickAssist capability, the addition of two new 10 GBASE Kerem ports (KR) and associated Media Access Controllers (MAC) to support these KR ports. In short, we had to integrate two silicon proven IPs into a PRQ’ed SoC
Team Management
Director - ASIC Design (Alphawave Semi)
Physical Design Manager (Intel Semiconductors)
SOC FCT Execution Lead and Manager (~2 years)
PVC Base Die SOC FCT - Managing Team of 35+ people towards the single goal of SOC FCT convergence. This also includes the noise and caliber (intel internal ruleset for quality)
Design Complexity
ATS SOC FCT - Managing Team of 25+ People towards the single goal of SOC FCT convergence. This also includes Noise and Caliber (intel internal ruleset for quality)
Design Complexity
SOC Timing Lead for: (~5 years)
Broadwell Chops - DE, LCC, MCC, HCC
BDXNS-CPM
Member of POSH team @ Alphawave Semi
Reviewer @ Intel:
Mentor @ Intel:
Coach @ Intel:
Educational Summary
I have done my ME in Microelectronics from BITS, Pilani in 2000-2001 with CGPA 9.51, and my BE in Electronics and Communication from MVJ College of Engineering, Bangalore in 1995-1999, with a 4 years aggregate of 72.5%.