Summary
Overview
Work History
Education
Skills
Accomplishments
Additional Information
Timeline
Generic
RAHUL VISHAL

RAHUL VISHAL

Director - ASIC Design (Alphawave Semi)
Bangalore

Summary

Working as Director - ASIC Design at Alphawave Semi , talented with excellent employee development, customer service and analytics skills coupled with more than 23 years of experience. Comfortable giving engaging presentations to clients to drive new business, expand accounts and establish brand profile. Excellent team builder and leader of initiatives. Passionate about applying excellent organization and communication skills to manage and lead teams.

In Past, worked as SOC Design Engineering Manager at Intel India prior to Alphawave. Adept in complete closure of Physical Design (from RTL to GDS2) with added expertise in large Team Management. Expertise in driving complex projects to completion, managing large teams, and achieving SOC convergence. Skilled in PD, STA, DFT, DRC, Signal EM, IR analysis, etc and fostering a goal-oriented team environment, demonstrating exceptional leadership and technical prowess.

Encouraging manager and analytical problem-solver with talents for team building, leading and motivating, as well as excellent customer relations aptitude and relationship-building skills. Proficient in using independent decision-making skills and sound judgment to positively impact company success. Dedicated to applying training, monitoring and morale-building abilities to enhance employee engagement and boost performance.

Pursuing full-time role that presents professional challenges and leverages interpersonal skills, effective time management, and problem-solving expertise.

Overview

23
23
years of professional experience
6
6
years of post-secondary education
4
4
Languages

Work History

Director - ASIC Design

Alphawave Semi
05.2022 - Current

As Director, was directly involved in Focal discussions, Finance discussions and management decisions. Also an active member of the POSH team.

Few key highlights:

  • Proactively identified potential risks and implemented mitigation strategies to minimize negative impacts on projects or business operations.
  • Managed cross-functional teams effectively to ensure timely delivery of high-quality products within budget constraints.
  • Established a culture of continuous improvement by fostering open communication channels and empowering employees to voice their ideas.
  • Optimized design team efficiency for faster project completion through streamlined communication channels and regular progress updates.
  • Improved project efficiency with strategic planning, resource allocation, and time management practices.


Key Projects Driven:

Networking SOCs for US based customer - Managing two large SOCs from the same customer - Switch & HFI, both in N7 (TSMC). Managing the complete PD, DFT and STA team from starting and included the PV and IR team towards the end. Overall a team size of close to 50 resources. Also managed the IT, compute planning, tool licenses, and anything that came under the purview of work.

  • Design Complexity (Switch) 200M Instances – Flat SOC FCT using tempus (1.6 Ghz)

Die Size: 24.6mm x 15.77mm, Package : HDBU (8-2-8)

SRAM Size : 351 MB, Signal I/Os : 897 TSMC 7nm Process

  • Design Complexity (HFI) 40M Instances – Flat SOC FCT using tempus (1.6 Ghz)

Die Size: 38mm2, SRAM Size : 83.5 MB,

Signal I/Os : 50 differential high-speed; 75 single-ended slow-speed

112G SerDes x 8 lanes (106Gbps used)

PCIe Gen5 x 16 lanes TSMC 7nm Process


SOC Design Engineering Manager

XNE, Intel India
3 2019 - 05.2022

Physical Design Manager (~1 year)
GNRD-IO Die - Managing a team of 35+ employees (internal and contract workers) to deliver the various milestones for 2 SubFCs (Tiles) and 1 SS in Physical Design. Horizontally, owning the FCT, Power Convergence & Quality team. Design is in Intel 7nm node.


SOC FCT Execution Lead and Manager (~2 years)
PVC Base Die SOC FCT - Managing Team of 35+ people towards the single goal of SOC FCT convergence. This also includes the noise and caliber (intel internal ruleset for quality)


  • Design Complexity
    64M Instances – Flat SOC FCT Model using PrimeTime
    2.4K Clocks – Highest Clock Freq 2.4Ghz
    650mm2 10nm Base Die
    Intel 10nm Process


ATS SOC FCT Manager - Managing Team of 25+ People towards the single goal of SOC FCT convergence. This also includes Noise and Caliber (intel internal ruleset for quality)

  • Design Complexity
    45M instances – Flat SOC Model using PrimeTime
    1.4K clocks – Highest Clock Freq 2Ghz
    Intel 10nm Process

Senior Tech Lead

Intel Technology India Pvt Ltd
06.2013 - 03.2019

SOC Timing Lead for: (~5 years)
Broadwell Chops - DE, LCC, MCC, HCC

Broadwell is the fifth model generation of Intel Processor. It's Intel's codename for the 14 nanometer die shrink of its Haswell micro-architecture. It is a "tick" in Intel's tick–tock principle as the next step in semiconductor fabrication. Like some of the previous tick-tock iterations, Broadwell did not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there were no low-end desktop CPUs based on Broadwell
BDXNS-CPM
BDX-NS is an SoC derivative of Broadwell Server-DE (Xeon D), a Xeon class server SoC product targeted for Network & Storage markets. The key changes in this Xeon SoC derivative with respect to the baseline product are the integration of Crypto Processing Module (CPM) IP on die to provide Intel QuickAssist capability, the addition of two new 10 GBASE Kerem ports (KR) and associated Media Access Controllers (MAC) to support these KR ports. In short, we had to integrate two silicon proven IPs into a PRQ’ed SoC

Technical Lead

Texas Instruments
08.2010 - 06.2013
  • Proved successful working within tight deadlines and fast-paced atmosphere.
  • Led projects and analyzed data to identify opportunities for improvement.

Tech Lead

NXP Semiconductors
10.2006 - 08.2010

Senior Design Engineer

Philips Semiconductors India Pvt Ltd
04.2006 - 10.2006

Senior Engineer

ICDC - Bharat Electronics Limited
02.2002 - 04.2006

Education

ME (microelectronics) - Microelectronics

BITS, Pilani
Pilani
06.2000 - 12.2001

BE (Electronics And Communication) - Electronics And Communication

MVJ College of Engineering
Bangalore
06.1995 - 10.1999

Skills

Team Management

Accomplishments

Director - ASIC Design (Alphawave Semi)

  • Ridley aka Switch : Managing a team of 60+ people to deliver the complete SOC to client (Major networking company based out of US) with NextGen Switch.


Physical Design Manager (Intel Semiconductors)


  • GNRD-IO Die - Managed a team of 60+ employees (internal and contract workers) to deliver the various milestones for 2 SubFCs (Tiles) and 1 SS in Physical Design. Horizontally, owning the FCT & Power convergence team.

SOC FCT Execution Lead and Manager (~2 years)

PVC Base Die SOC FCT - Managing Team of 35+ people towards the single goal of SOC FCT convergence. This also includes the noise and caliber (intel internal ruleset for quality)

Design Complexity

  • 64M Instances – Flat SOC FCT Model using PrimeTime
  • 2.4K Clocks – Highest Clock Freq 2.4Ghz
  • 650mm2 10nm Base Die
  • Intel 10nm Process

ATS SOC FCT - Managing Team of 25+ People towards the single goal of SOC FCT convergence. This also includes Noise and Caliber (intel internal ruleset for quality)

Design Complexity

  • 45M instances – Flat SOC Model using PrimeTime
  • 1.4K clocks – Highest Clock Freq 2Ghz
  • Intel 10nm Process

SOC Timing Lead for: (~5 years)

Broadwell Chops - DE, LCC, MCC, HCC

  • Broadwell is the fifth model generation of Intel Processor. It's Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick–tock principle as the next step in semiconductor fabrication. Like some of the previous tick-tock iterations, Broadwell did not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there were no low-end desktop CPUs based on Broadwell

BDXNS-CPM

  • BDX-NS is an SoC derivative of Broadwell Server-DE (Xeon D), a Xeon class server SoC product targeted for Network & Storage markets. The key changes in this Xeon SoC derivative with respect to the baseline product are the integration of Crypto Processing Module (CPM) IP on die to provide Intel QuickAssist capability, the addition of two new 10 GBASE Kerem ports (KR) and associated Media Access Controllers (MAC) to support these KR ports. In short, we had to integrate two silicon proven IPs into a PRQ’ed SoC

Additional Information

Member of POSH team @ Alphawave Semi

  • Investigated a case of harrasment as a POSH member

Reviewer @ Intel:

  • DTTC Reviewer for 2021, 2017 & 2019 (Design Test and Technology Conference)
  • Approved Timing Reviewer for SDG 10nm
  • Reviewed multiple projects for various milestones – like ICXD, SPR IPS, ICXSP – IPS, etc

Mentor @ Intel:

  • Recognized Mentor for GTCHE – Virtual Speed Mentoring Program
  • Recognized as a Mentor for XNE D&I (Diversity and Inclusion)

Coach @ Intel:

  • Training Class given at Intel Learning Platform - Timing Basics and STA Overview (ID: 20005313)


Educational Summary

I have done my ME in Microelectronics from BITS, Pilani in 2000-2001 with CGPA 9.51, and my BE in Electronics and Communication from MVJ College of Engineering, Bangalore in 1995-1999, with a 4 years aggregate of 72.5%.

Timeline

Director - ASIC Design

Alphawave Semi
05.2022 - Current

Senior Tech Lead

Intel Technology India Pvt Ltd
06.2013 - 03.2019

Technical Lead

Texas Instruments
08.2010 - 06.2013

Tech Lead

NXP Semiconductors
10.2006 - 08.2010

Senior Design Engineer

Philips Semiconductors India Pvt Ltd
04.2006 - 10.2006

Senior Engineer

ICDC - Bharat Electronics Limited
02.2002 - 04.2006

ME (microelectronics) - Microelectronics

BITS, Pilani
06.2000 - 12.2001

BE (Electronics And Communication) - Electronics And Communication

MVJ College of Engineering
06.1995 - 10.1999

SOC Design Engineering Manager

XNE, Intel India
3 2019 - 05.2022
RAHUL VISHALDirector - ASIC Design (Alphawave Semi)