Summary
Overview
Work History
Education
Skills
Websites
Timeline
Generic

SAI PAVAN KUMAR KANDREGULA

Visakhapatnam

Summary

Accomplished Physical Design Engineer with 4 years of experience in advanced nodes (5nm/6nm/7nm) managing end-to-end block implementation. Specializes in floorplan, placement, congestion optimization, CTS, ECO implementation, STA, and physical verification, effectively closing timing and congestion issues in DRC-critical blocks within high-performance SOC environments.

Overview

5
5
years of professional experience

Work History

Physical Design Engineer

Qualcomm (parent company : Lancesoft)
Chennai
03.2025 - Current

Project 3:

Block: Tile4

Design spec: 2 million Instance count, 44 macros operating at 960 MHz

Tools: Innovus , ICC2

  • Owned and handled the block from floorplan to signoff, driving implementation, timing closure, physical verification and ECO activities across all stages.
  • The design has 7K Feedthrough ports. Feedthrough buffering was handled using a custom tcl script and port placement was performed accordingly to avoid crisscross connections
  • Implemented TI (Transport inverter) as preroutes at the floorplan stage and addressed various challenges related to TI Implementation.
  • Added hold padding to avoid hold violations caused by 8T flop Implementation
  • Analyzed and addressed timing degradation at different stages of the block, including placement, CTS and post-route.
  • Analyzed FV non-equivalents and CLP violations. Fixed PDN high resistance violations, DRV violations such as max transition and max capacitance, along with DRC, LVS and crosstalk fixes.
  • Implemented ECO's to achieve signoff quality and addressed block-level timing by consuming tweaker, primeclosure and DMSA eco's.

Project 2:

Block: Tile3

Design spec: 3 million Instance count, 128 macros operating at 960 MHz

Tools: Innovus , ICC2

  • Owned end-to-end block-level physical design from floorplan to sign-off (placement, CTS, routing, PDN, STA, PV, FV/CLP), delivering a fully clean block across multi-corner, multi-mode scenarios.
  • Transformed a congestion- and timing-critical block by reducing global congestion from 1.29 to 0.13 through congestion-driven placement, block shape optimization, macro re-placement, and partial blockages. Improved setup timing from 800 ps to 50 ps via Vt optimization and floorplan refinement.
  • Resolved severe hold violations at CTS stage (-1.2 ns across 12 paths) by applying placement bounds and targeted optimization, achieving near-clean hold closure at -0.04 ns (40 ps).
  • Reduced routing shorts significantly from 800 to 65 by optimizing port placement patterns and introducing routing blockages in high-density regions; achieved zero DRC and zero shorts during the ECO cycle.
  • Drove sign-off quality timing closure by fixing max transition, max capacitance, crosstalk, antenna violations, and closed timing using Tweaker, DMSA, and PrimeClosure, ensuring robust cross-corner convergence.

Physical Design Engineer

Samsung (parent company: Lancesoft)
Bengaluru
07.2024 - 10.2024
  • Working as a physical design engineer.
  • Handled various aspects of physical design, such as floorplan, clock tree synthesis, and routing.

Physical Design Engineer

Advanced Micro Devices (AMD-Client)
Hyderabad
09.2022 - 05.2024
  • Parent company: Terascale Technologies Pvt Ltd

Project 1:

  • Responsible for Place & Route, Timing, and PV closure. Resolved congestion issues during macro placement by following macro placement guidelines.
  • Handled various sign-off issues while managing blocks such as CLP, UPF, and LEC. Addressed DRV fixes like DRCs, LVS, and antenna during ECO implementation.
  • Created PG regions for multi-voltage domain implementation. Performed a customized placement of level shifters.
  • Implemented analog routing and custom routes, guiding placement in macro channels with checker-box blockages to enhance design flow.

Physical Design Intern

Proteantecs
Bengaluru
08.2021 - 05.2022
  • Worked on Digital VLSI as a Physical Design Engineer from RTL to GDSII.
  • Utilized Cadence (Genus and INNOVUS) and Synopsys (DC, ICC2, and PrimeTime) tools for various design projects.
  • Enhanced and automated RTL to GDSII Proteantecs flow to increase efficiency.
  • Diagnosed bugs and determined root causes to improve design reliability.

Education

MTech - VLSI DESIGN

VIT University
Chennai, India
05-2022

Bachelor of Technology - Electrical and Electronics Engineering

Vignan's Institute of Information Technology
Visakhapatnam, India
05-2019

Skills

  • Floorplan
  • Placement
  • Clock Tree Synthesis
  • Routing
  • Physical Verification
  • DRC
  • LVS
  • EM & IR
  • Antenna
  • Crosstalk
  • ICCOMPILER II (ICC2)
  • Innovus
  • Fusion Compiler (FC)
  • TCL
  • UNIX

Timeline

Physical Design Engineer

Qualcomm (parent company : Lancesoft)
03.2025 - Current

Physical Design Engineer

Samsung (parent company: Lancesoft)
07.2024 - 10.2024

Physical Design Engineer

Advanced Micro Devices (AMD-Client)
09.2022 - 05.2024

Physical Design Intern

Proteantecs
08.2021 - 05.2022

MTech - VLSI DESIGN

VIT University

Bachelor of Technology - Electrical and Electronics Engineering

Vignan's Institute of Information Technology
SAI PAVAN KUMAR KANDREGULA