Jeswanth Ravula

• 8.5+ Year Industrial experience in CAE/CFD computational domain. Working as Thermal Application Engineer in ENNOVI (formerly Interplex Electronics India PVT Ltd) to perform Thermo-Electric Simulations on Battery Module Interconnects.
• Worked as Thermal Engineer in Intel Corporation to perform Electronic cooling devices on GPU, Computer Storage and Networking.
• Worked as a Senior Modeling Engineer in Lam Research to perform Flow, chemical, thermal and thermal stress computation for semiconductor processing equipment.
• Worked at Hubbell India as a CFD engineer and perform CFD, Structural & Thermal simulation for Commercial Outdoor and Indoor Lighting Products using ANSYS Tools.
• Worked at ANSYS Inc to support on CFD tools for Academic customers over PAN India.
• Published Paper in Science Direct (Elsevier) and presented research work on high temperature superconductivity materials at university of Twente, Netherlands, and Received Best Poster Presentation Award.
• Experienced in ANSYS ICEPAK, Fluent, COMSOL, Open FOAM, Programming/scripting, Python, MATLAB.

• R. Jeswanth, et al., “Analytical approximations for thermophysical properties of supercritical nitrogen (SCN) to be used in futuristic high temperature superconducting (HTS) cables”, Physics Procedia, Elsevier, Accepted.
• R. Jeswanth, et al., “Development of Correlations for Thermophysical Properties of Supercritical Nitrogen to be used in High Temperature Superconducting (HTS) Cable”, Physics Procedia, Elsevier, Accepted.
• R. Jeswanth, et al., “Thermo-Mechanical analysis of a HTS cable with various corrugation geometries”, Advances in cryogenic engineering, American institute of physics (AIP), Accepted.

• Two patents have been filed based on the improvement and suggestion from the Modeling work done in Lam Research to improve effectiveness of tools.
• CAE Engineer of the month (December 2016) in ANSYS Inc, Bengaluru.
• Won several prizes in sports like athletics, Basketball, tennis during graduation.
• Triple Crown and Path Breaker Awardee in Toastmasters Inc.
• Active Member of Toastmasters since 2018.

Ather 450X SC Lambus Battery Module Design

Objective:

The goal of the project is to design and develop a Battery Module Interconnects for Ather 450X SC Lambus.

Implemented:

Designed and Developed Interconnects for battery module application with proper cooling in order to maintain the max operating and derating temperatures of the components using commercial CFD codes for different operating conditions as per customer needs.

Software used: ANSYS ICEPAK 

RLT 1T 300W & 2T 600W, 800W Thermal Mechanical Product Design

Objective:

The goal of the project is to design and develop a Graphic Card for HPC and Networking application.

Implemented:

Designed and Developed a Graphic Card (RLT 1T, 2T 300W, 600W & 800W) for HPC and Networking applications by designing the module with proper cooling in order to maintain the max operating and derating temperatures of the components using commercial CFD codes for different work loads as per customer needs.

Software used: ANSYS ICEPAK and FloTHERM

PECVD-AHM Showerhead Cooling Optimization

Objective:

The goal of the analysis is to figure out the optimal cooling design (to compensate for the plasma heat load during depositions so that

showerhead temperature fluctuations are kept to a minimum) to address this problem.

Implemented:

Transient heat transfer analysis is carried out for AHM rev3 SHD in two steps, a steady state heat transfer analysis with SHD face plate

temperature set point temperature to 300C with cartridge heaters on (duty cycle 50%). This is followed by a transient analysis step where the

heaters are switched off and plasma power is switched on for 750 seconds and the rise in temperature at the TC locations are monitored and

correlated with experimental results. Several design variations are tried to mitigate the rise in temperature at TC location.

Software used: ANSYS Fluent

PECVD-AHM SH Thermal Uniformity Analysis

Objective:

To Understand the showerhead face thermal uniformity at various process conditions.

Implemented:

Steady state heat transfer analysis is carried out for AHM SHD with available process conditions and is followed by stress analysis to

compute the stresses induced in the assembly due to the thermal loads

Software used: ANSYS Fluent

O2 and NF3 cleaning in AHM HXE Chamber

Objective:

The objective is to compare O2 and NF3 cleaning for chamber with Rev3 and Rev4 showerhead assembly

Implemented:

Steady state flow analysis carried out for AHM HXE chamber with available process conditions, chemical kinetics and estimated the fluorine

recombination spots within the chamber assembled.

Software used: ANSYS Fluent

DM-Halo HX NGK Pedestal Thermal Design

Objective:

To evaluate the temperature and stress distribution of the HALO GX tool for SHD temperature gradient 20C (220C center to 200C edge)

Implemented:

Sequentially coupled thermal electric and stress analysis is carried out. Steady state heater transfer analysis is carried out to evaluate the

temperature distribution of the HALO GX assembly for pedestal set point temperatures of 700C. The results of these are mapped on to the

stress model to evaluate the stresses due to thermal gradients.

Software used: ANSYS Fluent and ANSYS Icepak