Results-driven CPU Physical Design Engineer with 8+ years of experience in EMIR sign-off, power integrity, reliability, and physical verification at advanced technology nodes. Proven expertise in full-chip and block-level physical design, power grid optimization, and tape-out sign-off, delivering robust, manufacturable designs across high-volume SoC products.
Overview
7
7
years of professional experience
Work History
CPU Physical Design Engineer
Intel Technology India Pvt Ltd
Bengaluru
07.2017 - 11.2024
Led full-chip and block-level EMIR sign-off, Joule heating, and thermal analysis using RedHawks-SC, ensuring compliance with foundry and reliability limits.
Performed early-stage EMIR feasibility analysis to influence floor planning and power grid strategy.
Improved EMIR margins through cell spreading, decap insertion, routing optimization, and metal/via enhancements.
Executed static and dynamic IR drop analysis (vector-based and vectorless) for critical power domains.
Collaborated closely with PD, STA, and power teams to deliver timing-safe EMIR ECOs.
Drove hierarchical data path blocks and full-chip layout convergence, including placement, routing, physical verification, RV, and extraction through sign-off.
Designed complex physical layouts for integrated circuits and semiconductor devices.
Developed and maintained design documentation for multiple projects simultaneously.
Mentored junior engineers on best practices in physical design techniques.
Education
Master of Science - Electronic Science
University of Pune
Pune
06-2015
Skills
EMIR sign-off (static and dynamic IR drop, EM, Joule heating, thermal)
Power grid design and optimization
Vector and vectorless IR analysis
Full-chip and block-level physical design
Physical verification (DRC/LVS) and extraction
Timing-safe EMIR ECO implementation
Layout convergence
Technical documentation
Problem solving
Team mentoring
Tools & Technologies
RedHawk-SC, Totem: IR, EM, thermal
Synopsys: ICC2, StarRC, IC Validator
Intel proprietary physical design and sign-off tools
• Achieved first-pass EMIR sign-off on high-volume CPU/SoC products • Reduced peak dynamic IR drop by ~25% through targeted power grid optimization • Closed critical EM violations on clock and power routes without timing regressions • Successfully completed 6 tape-ins, including 4 PRQs, across 14nm, 10nm, and 7nm nodes • Delivered waiver-free PV & RV sign-off on multiple projects • Recognized for exceptional commitment to RV sign-off and tapeout execution • Awarded for custom layout design and physical verification excellence